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Multiphysics modeling and simulation drives innovation across industries and academia — as is evidenced by the many uses showcased in the technical papers and posters presented by engineers, researchers, and scientists at the COMSOL Conference each year.

Draw inspiration from the recent proceedings collected below, or, to find a specific presentation or filter by application area or conference year/location, use the Quick Search tool.

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Structural Mechanics and Thermal Stresses

Simulation of a Modular Die Stamp for Micro Impact Extrusion

A. Schubert[1][2], R. Pohl[1], and M. Hackert[1]
[1]Chair Micromanufacturing Technology, Faculty of Mechanical Engineering, Chemnitz University of Technology, Chemnitz, Germany
[2]Fraunhofer Institute for Machine Tools and Forming Technology, Chemnitz, Germany

Micro impact extrusion is investigated at Chemnitz University of Technology as a potential procedure for large area machining of micro cavities within the scope of the SFB/Transregio 39 PT-PIESA of the German Research Foundation. Applying impact extrusion micro forming is done by ... Read More

Punch Design for Uniaxial Forging Process of γ-TiAl Using COMSOL Multiphysics^®

R. Cagliero[1] and G. Maizza[1]
[1]Dipartimento di Scienza dei Materiali ed Ingegneria Chimica, Politecnico di Torino, Torino, Italy

The increasing demand for improved metallurgical products strongly motivates the optimization of manufacturing processes and design of γ-TiAl products. Among the large variety of available forming processes, cold closed-die forging is particularly suitable for producing net shape ... Read More

Stress Field Simulation for Quantitative Ultrasound Elasticity Imaging

L. Yuan[1] and P.C. Pedersen[1]
[1]Department of Electrical and Computer Engineering, Worcester Polytechnic Institute, Worcester, Massachusetts, USA

Finite element models using COMSOL Multiphysics and MATLAB were developed to solve the problem of stress distribution interior homogeneous, isotropic, incompressible elastic solid material under known vertical external compression with a rectangular contact surface. Moreover, comparison ... Read More

Stress State Determination in Nanoelectronic Silicon Devices Coupling COMSOL Multiphysics and a Recursive Dynamical CBED Pattern Simulation

A. Spessot[1,2], S. Frabboni[1], A. Armigliato[3], and R. Balboni[3]
[1]Numonyx Advanced R&D NVMTD-FTM, Agrate Brianza, Italy
[2]National Research Center S3, CNR-INFM and Department of Physics, University of Modena e Reggio Emilia, Modena, Italy
[3]CNR-IMM Section of Bologna, Italy

Strained technology is being promoted as the best way to extend the performance of semiconductor transistors. An inhomogeneous layer deposited on top of a silicon device can induce a strong modification in the real silicon strain state, and consequently in its electronic performance. ... Read More

Computational Analysis of the Mechanical and Thermal Stresses in a Thin Film PProDOT-Based Redox Capacitor

J. Sotero-Esteva[1], M. Rosario-Canales[2], P. Gopu[3], and J. Santiago-Avilés[3]

[1]Department of Mathematics, University of Puerto Rico at Humacao, Humacao, PR
[2]Department of Chemistry, University of Pennsylvania, Philadelphia, PA, USA
[3]Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, PA, USA

Among the several types of capacitors, the double-layer and redox types have gathered increasing attention to address some of the heavy power demands of modern technology. In redox capacitors, charge is stored chemically via oxidation/reduction processes in the active materials like ... Read More

Analysis of the Mechanical Behavior of Violins Based on a Multi-physics Approach

E. Ravina
Dept. of Mechanics and Machine Design, Research Centre on Choral and Instrumental Music (MUSICOS), University of Genoa, Italy

The paper attempts to give a contribution to the dynamic analysis of musical instruments. A multidisciplinary approach oriented to the study of mechanical, structural, vibratory and acoustical phenomena related to stringed instruments is discussed. The case study focused in this paper ... Read More

A Numerical Model for Transient Heat Conduction in Semi-Infinite Solids Irradiated by a Moving Heat Source

N. Bianco[1], O. Manca[2], S. Nardini[2], and S. Tamburrino[2]
[1]Dipartimento di Energetica, Termofluidodinamica applicata e Condizionamenti ambientali, Università degli Studi Federico II, Napoli, Italy
[2]Dipartimento di Ingegneria Aerospaziale e Meccanica, Seconda Università degli Studi di Napoli, Aversa (CE), Italy

A numerical analysis on transient three-dimensional temperature distribution in a semi-infinite solid, irradiated by a moving Gaussian laser beam, is carried out numerically by means of the code COMSOL Multiphysics. The investigated workpiece is simply a solid. A laser source is ... Read More

Numerical and Experimental Analysis of Natural and Mixed Convection Heat Transfer for Vertically Arranged DIMM

G. Petrone, and G. Cammarata
University of Catania, Catania, Italy

It is commonly recognized that careful thermal design of electronic equipments represents an unavoidable pre-production step in order to ensure reliability and performance of those components during their functioning. This paper mainly concerns a comparison between experimental and ... Read More

Thermal and Material Flow Modelling of Friction Stir Welding Using COMSOL

H. Schmidt[1,2], and J. Hattel[1]
[1]Technical University of Denmark, Kgs. Lyngby, Denmark
[2]HBS Engineering, Frederiksberg, Denmark

Two friction stir welding models are presented – a global thermal model using the temperature dependent heat source and a local material flow and heat generation model allowing for detailed investigation of different contact conditions. The two models are coupled into a larger local ... Read More

Modeling the Thermally Induced Curvature of Multilayer Coatings with COMSOL Multiphysics^TM

H. Conrad[1], T. Klose[2], T. Sandner[2], D. Jung[1], H. Schenk[2], and H. Lakner[1,2]
[1]Semiconductor and Microsystems Technology Laboratory, Technische Universität Dresden, Germany
[2]Fraunhofer Institute for Photonic Microsystems Dresden, Germany

Within this paper the so called “birth and death” method is demonstrated in use with COMSOL Multiphysics®. With this method the free and reactionless movement of a solid structure on deformed geometries and the activation of this solid structure at later simulation steps is possible. For ... Read More

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