Model Gallery

Model ID: 2112

Copper Deposition in a Trench

This model demonstrates the use of moving meshes in the application of copper electrodeposition on circuit boards. In these environments, the presence of cavities or 'trenches' are apparent.

The model makes use of the Nernst-Planck application mode in combination with a Moving Mesh (ALE) application mode to keep track of the deformation of the mesh. Furthermore, electrochemical reaction kinetics through use of the Butler-Volmer equation for copper deposition are freely entered at the boundaries.

The model is inherently time-dependent and results clearly show that the mouth of the trench narrows, due to non-uniform deposition of the copper. In addition, the simulation shows a substantial variation in copper ion concentration along the length of the trench. Such effects can be detrimental to the quality of the deposition, creating corrosion possibilities, and also lead to material waste.

This figure shows the concentration distribution of copper ions, the iso-potential lines, the current density lines, and the displacement of the cathode and anode surfaces after 4.4 seconds of operation. It is clearly seen here that the mouth of the cavity is staring to narrow, due to the non-uniform thickness of the deposition.

• Click here to get more information about this model