BE CAE & Test Builds a Surface-Mount Device App for Thermal Analysis
Giuseppe Petrone, BE CAE & Test, Italy
BE CAE & Test, a COMSOL Certified Consultant, created a thermal model of a surface-mount device for a client and converted it into a simulation app with the Application Builder in COMSOL Multiphysics®, providing an interactive deliverable that could be used to investigate the system. Their clients are pleased to use an interactive tool with which they can investigate their system.
In the simulation app, the end user can vary the material of the solder layer and silicon die, thickness of the solder layer, and dissipated thermal power to examine the impact on maximum junction temperatures and junction-to-case thermal resistance.
Suggested Stories
Music to Your Ears: New Transducers Meet Electrostatic Headphones
Electrostatic transducers offer enhanced clarity, less distortion, and a wider bandwidth than transducers in ...
Simulating the Pressure in an Ultrahigh Vacuum System
The ETpathfinder research facility in the Netherlands was built in anticipation of the proposed Einstein Telescope ...
Opening the Path to Commercial Fusion Energy with Simulation
CFS has showcased the potential of high-temperature superconductor magnets and high-field tokamaks for fusion ...
Simulation Applications Streamline the Development of Electric Vehicle Motors
Engineers at Volkswagen Kassel build and distribute simulation applications that can be used to evaluate the strength ...
