BE CAE & Test Builds a Surface-Mount Device App for Thermal Analysis
Giuseppe Petrone, BE CAE & Test, Italy
BE CAE & Test, a COMSOL Certified Consultant, created a thermal model of a surface-mount device for a client and converted it into a simulation app with the Application Builder in COMSOL Multiphysics®, providing an interactive deliverable that could be used to investigate the system. Their clients are pleased to use an interactive tool with which they can investigate their system.
In the simulation app, the end user can vary the material of the solder layer and silicon die, thickness of the solder layer, and dissipated thermal power to examine the impact on maximum junction temperatures and junction-to-case thermal resistance.
Suggested Stories
Behind the Rumble and Roar of Mahindra Motorcycles
Optimization is a subtle and delicate art, especially when it comes to motorcycles. Regulatory requirements on pass-by ...
Multiphysics Software, a Versatile, Cost-Effective R&D Tool at Sharp
There are several kinds of technology that designers at Sharp Laboratories of Europe work to create. From LED ...
Analysis of Subsea Umbilicals and Cables
JDR Cables designs-to-spec and manufactures subsea umbilical systems of cables and reelers for the oil and gas and ...
Get a Quick Look at How Plastometrex Uses COMSOL Compiler™
Step into the world of the startup company Plastometrex to see how they developed an efficient method for measuring ...
