The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
The purpose of this app is to understand EIS, Nyquist, and Bode plots. The app lets you vary the bulk concentration, diffusion coefficient, exchange current density, double layer capacitance, and the maximum and minimum frequency. Electrochemical impedance spectroscopy (EIS) is a common ... Read More
Highly alloyed stainless steel used in chlorinated seawater systems may be prone to corrosion under certain operating conditions. Conventional cathodic protection technique is less suitable for stainless steel due to unacceptable anode consumption rate and propensity to hydrogen ... Read More
This model analyzes the thermal expansion in a MEMS device, such as a microgyroscope, where thermal expansion should be minimized. The device is made from the copper-beryllium alloy UNS C17500 and uses temperature-dependent material properties from the Material Library. The purpose of ... Read More
This example shows how to perform a fatigue analysis of a structure subjected to random vibrations. Times to failure using the cycle counting models according to Bendat and Dirlik are compared. Read More
Silicon micromechanical resonators have long been used for designing sensors and are now becoming increasingly important as oscillators in the consumer electronics market. In this series of models, a surface micromachined MEMS resonator, designed as part of a micromechanical filter, is ... Read More
An electrostatically actuated MEMS resonator is simulated in the time and frequency domains. The device is driven by an AC + DC bias voltage applied across a parallel plate capacitor. The dependence of the resonant frequency on DC bias is assessed, and frequency domain and pull-in ... Read More
Through-silicon vias (TSVs) allow chips or wafers to be connected vertically, making TSV a crucial technology for 2.5D and 3D packaging. The basic structure of a TSV consists of a deep hole penetrating a silicon substrate, a filling metal (usually copper) in the deep hole, and an ... Read More
This model shows that the frequency response, i.e., admittance curve, of the SAW unit cell with IDT is in good agreement with the series resonance & antiresonance frequencies obtained from the eigenfrequency studies in the tutorial Surface Acoustic Wave Velocity Calculations from a ... Read More
