The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
This model simulates arc welding of a titanium plate made from an alpha-beta titanium alloy. During a weld pass, the material experiences a thermal transient, including both heating and cooling. Phase transformations are modeled, and the evolution of the phase composition over time is ... Read More
Crimping is the plastic deformation process used to form an electrical joint between a stranded conductor and a terminal. The process involves complex multi-surface contact, including self-contact, as the terminal sleeve is plastically deformed around the wire strands. This example ... Read More
This model shows how to model a simple Metal–Insulator–Metal (MIM) diode. The two metal electrodes are defined on each side using the Metal Contact feature. Two studies were performed: one without quantum tunneling across the potential barrier and the other including it, using the WKB ... Read More
In a cooling system, a microelectronic component has been identified as the critical link. Since the power is repeatedly switched on and off, the component is subjected to thermal cycling. As a results a crack grows through a solder joint and disconnects the chip from the printed circuit ... Read More
A magnetic brake consists of a permanent magnet, which induces currents in a rotating copper disk. The resulting eddy currents interact with the magnetic flux to produce Lorentz forces and subsequently a braking torque. The disk angular velocity is computed using Simulink®. Read More
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... Read More
The modal dispersion in a metamaterial can be engineered by changing the type of material and dimension of the composing unit cells. For instance, a periodically organized subwavelength metal–dielectric layered metamaterial exhibits an anisotropic dispersion characteristic in the ... Read More
This example shows how to set up multiple sandwiched thin layers with different thermal conductivities in two different ways. First, the composite is modeled as a 3D object. In the second approach, the thin domains are modeled with thermal resistors in the Lumped Thermal System ... Read More
This tutorial model solves the Gross–Pitaevskii Equation for the vortex lattice formation in a rotating Bose–Einstein condensate bound by a harmonic trap. The equation is essentially a nonlinear single-particle Schrödinger Equation, with the inter-particle interaction represented by a ... Read More
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... Read More
