Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Thermal Simulations of a LED Light Using COMSOL Multiphysics

M. Maaspuro[1]
[1]University of Turku, Turku, FInland

An experimental LED light composed of a multi-chip LED-module, a LED driver and an efficient heat sink, was investigated using COMSOL Multiphysics software and the Heat Transfer Module. In an LED light heat is mainly generated in the LEDs but some amount of heat is generated also in the LED driver. The main target of the simulations was to resolve the junction temperatures of LEDs, the most ...

Analysis of Burning Candle

J.S. Crompton, L.T. Gritter, S.Y. Yushanov, and K.C. Koppenhoefer
AltaSim Technologies LLC, Columbus, OH, USA

Analysis of burning candles is extremely complex; combustion produces a highly non-linear temperature profile through the flame in which local temperatures may exceed 1400 °C. Heat transfer includes radiation, conduction and convection components and the low melting point of the candle wax leads to a phase change that allows mass transport via capillary flow prior to combustion in the flame. ...

Modeling Convection during Melting of a Phase Change Material

D. Groulx, and R. Murray
Mechanical Engineering
Dalhousie University
Halifax, NS

COMSOL Multiphysics can be used to model a latent heat energy storage system. A 2D numerical study was performed to simulate melting of a PCM including both conduction and convective heat transfer. The heat transfer in fluids and laminar flow physics interfaces were used. To model natural convection, proper volume force was applied to the PCM. The viscosity was input as a piecewise, continuous ...

Modelling of Pressure Profiles in a High Pressure Chamber using COMSOL Multiphysics

P. S. Rao[1], C. K. Chandra[1]
[1]Agricultural and Food Engineering Department, Indian Institute of Technology Kharagpur, West Bengal, India

High Pressure Processing (HPP) is a leading non-thermal food processing technology that is often cited as a major technological innovation in food preservation. Although it is very early to place this emerging technology among the list of breakthroughs in food processing, HPP has started to become a viable commercial alternative for pasteurisation of value added fruits, vegetables, meat, and ...

A Practical Method to Model Complex Three-Dimensional Geometries with Non-Uniform Material Properties Using Image-based Design and COMSOL Multiphysics®

J. Cepeda[1], S. Birla[2], J. Subbiah[2], H. Thippareddi[1]
[1]Department of Food Science & Technology, University of Nebraska, Lincoln, NE, USA
[2]Department of Biological Systems Engineering, University of Nebraska, Lincoln, NE, USA

Geometries with heterogeneous material properties are typically defined as a set of multiple parts, each part representing a different material. However, assembling or defining the individual parts of complex geometries can be difficult. A practical method based on image-based mesh generation, a custom algorithm for labeling materials, and interpolation functions of COMSOL Multiphysics® can be ...

Implementation of a Viscoelastic Material Model to Simulate Relaxation in Glass Transition - new

Z. Zheng[1], R. Zhang[1]
[1]Corning Incorporated, Corning, NY, USA

Introduction: Glass relaxation occurs in a range of temperature during transition from equilibrium to super-cooled liquid. Viscoelastic material model can be applied to simulate glass behavior during the glass transition regime and to predict the glass deformation and stress evolution. Viscoelasticity is the property of materials that exhibit both viscous and elastic characteristics when ...

Thermal Analysis of Induction Furnace

A. A. Bhat[1], S. Agarwal [1], D. Sujish[1], B. Muralidharan[1], B. P. Reddy[1], G. Padmakumar[1], K. K. Rajan[1]
[1]Indira Gandhi Center for Atomic Research, Kalpakkam, Tamilnadu, India

Induction furnaces are employed for vacuum distillation process to recover heavy metals after electro-refining operation. Induction furnace of suitable heating rate and cooled by passive means are required to be developed for this purpose. It is planned to set up a mock up induction furnace which will simulate the conditions to be realized in actual vacuum distillation furnace for this purpose. ...

Simulation of the Temperature Profile During Welding with COMSOL Multiphysics® Software Using Rosenthal's Approach - new

A. Lecoanet[1], D. G. Ivey[1], H. Henein[1]
[1]Department of Chemical & Materials Engineering, University of Alberta, Edmonton, AB, Canada

A 3D finite element analysis is carried out, using COMSOL® software, to reproduce the thermal profile obtained with Rosenthal’s equation. The implemented heat transfer equation has been modified as a means to approximate Rosenthal’s solution. An analysis of the differences between the simulation and Rosenthal’s solution, when the geometry of the domain and the source are changed, has been ...

Analysis of Thermoelectric Phenomena

J. Crompton, S. Yushanov, L. Gritter, and K. Koppenhoefer
AltaSim Technologies, LLC.
Columbus, OH

Thermoelectric phenomena provide the direct conversion of heat into electricity or electricity into heat, the phenomena is described by three related mechanisms: the Seebeck, Peltier and Thomson effects. Thermoelectric devices have found many applications ranging from temperature measurement, solid state heating or cooling and direct energy conversion from waste heat. In this paper, analysis ...

Power Transistor Heat Sink Design Trade-offs

T. Eppes, I. Milanovic, and G. Quarshie
University of Hartford
West Hartford, CT

Power transistors require heat sinks to dissipate thermal energy and keep junction temperatures below the recommended limit. The reliability and longevity of any semiconductor device is inversely proportional to the junction temperature. Hence, a significant increase in reliability and component life can be achieved by a small reduction in operating temperature. A range of heat sink designs ...

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