See How Modeling and Simulation Is Used Across Industries
Multiphysics modeling and simulation drives innovation across industries and academia — as is evidenced by the many uses showcased in the technical papers and posters presented by engineers, researchers, and scientists at the COMSOL Conference each year.
Draw inspiration from the recent proceedings collected below, or, to find a specific presentation or filter by application area or conference year/location, use the Quick Search tool.
View the COMSOL Conference 2025 Collection
The research project under which the COMSOL simulations are performed deals with multilayer and fine thermal control of an optical reference cavity for space applications. The cavity, made of Ultra Low Expansion glass (Corning ULE), must be kept close to the zero expansion temperature of ... Read More
In this paper a methodology for calculating the infrared signature of complex objects is presented. The transient thermal analysis allows us to evaluate the temperature distribution on the investigated object, pointing out which parts tend to be warmer. These temperature values are ... Read More
Outline of presentation: theory of phase-field modeling of ferroelectric materials parameter identification in free energy density finite element implementation: PDE form weak form periodic boundary conditions: electrical mechanical domain configurations intrinsic and extrinsic ... Read More
Svante Littmarck is the CEO of the COMSOL group. He co-founded COMSOL in 1986. He holds a M.Sc. in Applied Mathematics from the Royal Institute of Technology in Stockholm. In 2004 he received an honorary doctoral degree from the Royal Institute of Technology. Read More
The hot stamping of boron steels for producing complex structural components of the car body-in-white is more and more widespread. Optimization of sheet forming technologies at elevated temperatures is still troublesome, since the thermal, mechanical and metallurgical phenomena ... Read More
The oxidation behavior of metallic nanoparticles is investigated in respect to material parameters like Mott potential, defects on the microstructure and oxide volume increase per ionic defect. An emphasis is laid on magnetic nanoparticles where the degree of oxidation can be measured ... Read More
Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive ... Read More
Jet Electrochemical Machining (Jet-ECM) is an unconventional procedure using localized anodic dissolution for micromachining. An increasing of the electrolyte temperature will lead to an increase of the electrical conductivity of the electrolyte by about 30% and to a reduction of the ... Read More
Capacitor Discharge Sintering (CDS) is an ultrafast Electric Current Assisted Sintering method (u-ECAS) suited for electrically conductive powders. It is characterized by relatively short processing times (milliseconds range) and much lower sintering temperatures than the melting point ... Read More
The excessive presence of residual SiC matrix inter-fiber pores is often the main cause for the very poor mechanical strength and toughness of SiC/SiC composites manufactured by CVI (Chemical Vapour Infiltration) process. This work presents a micro/macro Microwaveassisted Chemical Vapour ... Read More