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Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Elastoplastic Deformation in a Wedge-Shaped Plate Caused by a Subducting Seamount

M. Ding[1], J. Lin[2]
[1]MIT/WHOI Joint Program in Oceanography, Cambridge, MA, USA
[2]Woods Hole Oceanographic Institution, Woods Hole, MA, USA

We used COMSOL Multiphysics 4.3 to simulate the 2D elastoplastic deformation and plastic strain in a wedge-shaped plate above a subducting interface. The modeling results reveal that a pair of conjugate normal faults would first appear in the thinner part of the plate. Subsequently, a second pair of conjugate thrust faults would form in the thicker part of the plate. The duration of the seamount ...

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits - new

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have all different thermoelastic properties, these stress can be critical for the chip connections. To ...

Effects of Solvers on Finite Element Analysis in COMSOL Multiphysics® Software - new

C. Ravi[1]
[1]Siemens Technology and Services Private Limited, Bengaluru, Karnataka, India

Introduction: Solver section of FEA plays a very important role; it takes the input from the preprocessor and solves millions of equations using numerical methods. Capability of any analysis tools can be measured based on the solver. Understanding the nature and operation of various structural solid mechanics solvers is the interest of the present study. Results: Contact pressure is evaluated ...

Time-Dependent Thermal Stress and Distortion Analysis During Additive Layer Manufacturing, by Powder Consolidation by Laser Heating

M.S. Yeoman[1], J. Sidhu[2]
[1]1. Continuum Blue Ltd., Tredomen Innovation & Technology Park, Tredomen, Ystrad Mynach, United Kingdom
[2]BAE Systems, Advanced Technology Centre, Bristol, United Kingdom

A time-dependent COMSOL Multiphysics model of an additive manufacture process, which uses powder consolidation by laser heating was developed, providing a platform to better understanding the manufacture process & provide a tool to reduce resulting distortion & optimization of an additive manufacture process. The model simulates a high intense laser energy source moving along a pre-defined time ...

Analysis to Determine Optimum Strain Gauge Locations for SENSEWHEEL - new

T. Suzuki[1], C. Holloway[1], S. Taylor[1]
[1]University College London, London, UK

Manual wheelchair users suffer shoulder pain and injury in the long term because of unconscious overuse. The ‘SENSEWHEEL’, which interposes three identical load cells between pushrim and rear wheel, measures the three components of pushing force Fx, Fy and Fz, and axial torque Tx applied at each load cell. Strain gauges were located on a diaphragm forming one face of the load cell. The ...

A Numerical Study for Rubber Particles Collection Involved in New Thermoforming Composite Process Using COMSOL Multiphysics®

R. Carbone[1], V. Antonelli[2][3], A. Langella[1], and R. Marissen[3]

[1]Material and Production Engineering Department, Università degli Studi di Napoli Federico II, Napoli, Italy
[2]Institute of Lightweight Structures, Technische Universität München, München, Germany
[3]Design and Production of Composite Structure, Delft University of Technology, Delft, The Netherlands

This paper deal of the forming process applied to the thermoplastic composites. A new thermoforming process that uses rubber particles collection as flexible mould was presented and numerically modeled. A characterization of the rubber in particles form was previously performed to value the material parameters in the user-defined hyperelastic constitutive laws employed in the FEM (Finite Element ...

A Simplified Approach to the Contact in Thermo-mechanical Analysis of Refractory Linings

Y. Kaymak
VDEh Betriebsforschungsinstitut GmbH
Düsseldorf, Germany

The geometrical design and material choice for a refractory lining requires a good understanding of its thermo-mechanical behavior. Design engineers clearly need a tool for fast and efficient computation of thermo-mechanical state of refractory linings under various conditions. However, standard simulation models and their solutions suffer as the linings are composed of many refractory blocks in ...

Densification and Shape Change of Calcined High Level Waste During Hot-Isostatic Pressing

T. Burnett, and D. Lower
CH2M-WG Idaho, LLC
The Idaho Cleanup Project at the Idaho National Laboratory
Idaho Falls, ID

Hot Isostatic Pressing (HIP) has been selected as a means of treating calcined high level waste (HLW). The process combines high temperature and pressure to densify the HLW in to a mineral similar to the geologic formulation of granite. This study uses COMSOL to predict densification and shape deformation of a stainless steel can filled with HLW. Two approaches were used to model densification ...

Optimized Cantilever-to-Anchor Configurations of Buckled Cantilever Plate Structures for Transducer Applications

A. Arpys Arevalo Carreno[1], D. Conchouso Gonzalez[1], I.G. Foulds[1]
[1]King Abdullah University of Science and Technology, Thuwal, Mecca, Kingdom of Saudi Arabia

The mechanical simulation and analysis of the cantilever-to-anchor configuration for an out-of-plane structure used in transducer applications is reported. The polymer-based Buckled Cantilever Plate “BCP” structure, gives the ability to orient an active device from a horizontal to a vertical position, once assembled. In this paper we compare four different cantilever-to-anchor ...

Designing and Simulating the Performance Analysis of Piezoresistive Fluid Flow Pressure Sensor

K. PraveenKumar[1], P. Suresh[1], K. Subash[1], M. Alagappan[1], A. Gupta[1]
[1]PSG College of Technology, Coimbatore, Tamil Nadu, India.

In this work, we present the performance analysis of novel micro machined Piezoresistive fluid flow pressure sensor using COMSOL Multiphysics. The principle of the sensing mechanism is based on the deflection of four sensing layers embedded on a thin membrane. The fluid passes through the layer causes the deflection of the sensing layer which measures the pressure of the fluid. The following ...