A Numerical Study for Rubber Particles Collection Involved in New Thermoforming Composite Process Using COMSOL Multiphysics®
R. Carbone, V. Antonelli, A. Langella, and R. Marissen
Material and Production Engineering Department, Università degli Studi di Napoli Federico II, Napoli, Italy
Institute of Lightweight Structures, Technische Universität München, München, Germany
Design and Production of Composite Structure, Delft University of Technology, Delft, The Netherlands
This paper deal of the forming process applied to the thermoplastic composites. A new thermoforming process that uses rubber particles collection as flexible mould was presented and numerically modeled. A characterization of the rubber in particles form was previously performed to value the material parameters in the user-defined hyperelastic constitutive laws employed in the FEM (Finite Element ...
G. Maizza, and R. Cagliero
Politecnico di Torino
Dipartimento di Scienza dei Materiali ed Ingegneria Chimica
In this work the influence of the geometry of the Vickers indenter tip on relevant indentation properties is investigated during instrumented indentation operated in the macro range (i.e. with forces ranging from 2 to 200 N) and carried out in the case of a homogenized (i.e. heat treated) TiAl alloy. The instrumented macro-indentation test is simulated by Comsol Multiphysics using a full 3D ...
P. Olsson, F. Larsson, A. Khlopotin, S. Razanica
Chalmers University of Technology, Gothenburg, Sweden
In solid mechanics, there is considerable interest in achieving “invisibility”. The applications in mechanics include protection of structures and parts of structures from potentially harmful transient waves and steady state vibrations. A suggested large scale application is that protection against seismic waves from earthquakes could be achieved by using cloaking to re-route the waves around ...
K. PraveenKumar, P. Suresh, K. Subash, M. Alagappan, A. Gupta
PSG College of Technology, Coimbatore, Tamil Nadu, India.
In this work, we present the performance analysis of novel micro machined Piezoresistive fluid flow pressure sensor using COMSOL Multiphysics. The principle of the sensing mechanism is based on the deflection of four sensing layers embedded on a thin membrane. The fluid passes through the layer causes the deflection of the sensing layer which measures the pressure of the fluid. The following ...
Numerical Behavior of Different COMSOL Solution Methods for a Heat Transfer Problem Coupled with a Structural Mechanics Problem
W. Joppich1, N. Kopp2, and D. Samokhvalov1
1University of Applied Sciences Bonn-Rhein-Sieg, Sankt Augustin, Germany
2Technisch Mathematische Studiengesellschaft GmbH, Bonn, Germany
We consider an object re-entering the atmosphere at high velocity and a certain angle. As the density of the atmosphere increases, the temperature of the material is increased by friction. It is of interest to know whether the body is only deformed, or if it is destroyed.To answer this question of how the object behaves, we have coupled two heat transfer problems to a structural mechanics ...
J. Mwebesa, D. Kalumba, and R. Kulabako
Studies by Nishaat (2009) showed that Terzaghi\'s bearing capacity model didn\'t adequately predict the bearing capacity failure in Philippi Dune sands. Nishaat carried out her investigation using a physical model that was built in a geotechnical laboratory. The failure surfaces she observed in the sands did not resemble those predicted by Terzaghi and Meyerhof\'s models. However the use of a ...
Evaluation of Low-Cycle-Fatigue Life of Solder Joints in Surface Mounting Power Devices by Finite Element Modeling
N. Delmonte, F. Giuliani, M. Bernardoni, P. Cova
Dipartimento di Ingegneria dell'Informazione, Università degli Studi di Parma, Parma, Italy
CDTR - Centre for Device Thermography and Reliability, H. H. Wills Dept. of Physics, University of Bristol, Bristol, United Kingdom
The reliability of solder joints [1,2] is one of the key factors in the determination of the reliability of the high power density electronic converters, being the solder joints both the mechanical, the electrical, and often the thermal connections between the electronic component and the board in which the component is placed. The main mechanism by which solder joints are damaged is thermal ...
Investigation of the Effect of Spinal Defects on Spondylolysis and Stress Fracture of Vertebral Bodies
M.S. Yeoman, C. Quah, A. Cizinauskas, K. Cooper, D. McNally, B. Boszczyk
Continuum Blue, Tredomen, Ystrad Mynach, United Kingdom
The Centre for Spinal Studies and Surgery, Queen’s Medical Centre, Nottingham, United Kingdom
Bioengineering Research Group, Faculty of Engineering, The University of Nottingham, Nottingham, United Kingdom
Spondylolysis (SL) is a defect of the spinal vertebra, and is typically caused by stress fracture of the pars interarticularis bone of the vertebral arch. It is especially common in adolescents who over train in sporting activities. Spina bifida occulta (SBO) is a malformation of the spine where the protruding vertebral bodies are not fully formed. In this study we demonstrate the predisposition ...
V. Antonucci, M. Esposito, R. Marzella, and M. Giordano
Institute for Composite and Biomedical Materials, CNR, Portici, NA, Italy
Imast, Portici, NA, Italy
A quasi static indentation test on a laminate composite has been investigated numerically and experimentally. In particular, the test has been implemented by COMSOL Multiphysics® and optimizing the Finite Element and mesh. In addition, the numerical strain results have been validated by the comparison with the respective experimental deformation data that have been obtained by fiber Bragg ...
Numerical and Experimental Analysis of Natural and Mixed Convection Heat Transfer for Vertically Arranged DIMM
G. Petrone, and G. Cammarata
University of Catania, Catania, Italy
It is commonly recognized that careful thermal design of electronic equipments represents an unavoidable pre-production step in order to ensure reliability and performance of those components during their functioning. This paper mainly concerns a comparison between experimental and numerical results obtained in studying thermal dissipation in natural and mixed convection conditions for RAM ...