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Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Study of the Process, Design, and Operating Parameters Effect on the Efficiency of the Process Mill - new

A. K. Farouk[1]
[1]Department of Mathematics & Natural Science, University of Stavanger, Sandnes, Rogaland, Norway

This study is to investigate the velocity pattern and the velocity magnitude of the cuttings that is being processed in the process mill as a result of the rotating hammers. The process mill consists of a horizontal cylindrical shell equipped with renewable liners and rotating hammers for milling of drill cuttings. An F.E model of the process mill was constructed using dimensions similar to ...

Effects of Solvers on Finite Element Analysis in COMSOL Multiphysics® Software - new

C. Ravi[1]
[1]Siemens Technology and Services Private Limited, Bengaluru, Karnataka, India

Introduction: Solver section of FEA plays a very important role; it takes the input from the preprocessor and solves millions of equations using numerical methods. Capability of any analysis tools can be measured based on the solver. Understanding the nature and operation of various structural solid mechanics solvers is the interest of the present study. Results: Contact pressure is evaluated ...

Prediction of Temperature and Thermal Stress in Plasma Sprayed Coatings - new

M. Raja[1] , G. Hiremath[1], K. Ramachandran[1], P.V.A. Padmanabhan[2], T.K. Thiyagarajan[2]
[1]Karunya University, Coimbatore, Tamil Nadu, India
[2]Bhabha Atomic Research Centre, Mumbai, Maharashtra, India

Plasma spraying is one of the prominent technologies for wear, corrosion and high temperature resistant coatings. The coating quality is very important to increase the performance of the components as well as to protect the outer surface of the component from external environment. The coating quality characteristics depend on many plasma process parameters. Among these parameters, distribution of ...

Using COMSOL to Support a Cost-Effective, Non-Destructive Evaluation Approach for Predicting Bolt Failure in Highway Bridges

A. Elyea, B. Doubek, G. Hubbard, and D. Ozevin
Department of Civil Engineering
University of Illinois at Chicago
Chicago, IL

The development of a quantitative nondestructive evaluation method, as an alternative to visual inspection, for inspecting pre-tensioned bolts in fracture critical bridges is presented. In order to understand the ultrasonic behavior of a wide variety of bolt geometries used in bridges, numerical models of nine different bolt geometries were developed. The numerical models included the ...

Optimized Cantilever-to-Anchor Configurations of Buckled Cantilever Plate Structures for Transducer Applications

A. Arpys Arevalo Carreno[1], D. Conchouso Gonzalez[1], I.G. Foulds[1]
[1]King Abdullah University of Science and Technology, Thuwal, Mecca, Kingdom of Saudi Arabia

The mechanical simulation and analysis of the cantilever-to-anchor configuration for an out-of-plane structure used in transducer applications is reported. The polymer-based Buckled Cantilever Plate “BCP” structure, gives the ability to orient an active device from a horizontal to a vertical position, once assembled. In this paper we compare four different cantilever-to-anchor ...

Micromechanical Design of Novel Thermal Composites for Temperature Dependent Thermal Conductivity - new

R. C. Thiagarajan[1],
[1]ATOA Scientific Technologies Pvt. Ltd., Bengaluru, Karnataka, India

Materials with an order variable in thermal conductivity as a function of temperature are desirable for thermoelectric heat energy recovery, building thermal insulation and solar thermal applications. Thermal Conductivity is an inherent material property. Engineering the fundamental thermal conductivity needs manipulation at thermal photon level for conventional materials. Engineering thermal ...

Numerical and Experimental Study of a Concentrated Indentation Force on Polymer Matrix Composites

V. Antonucci[1][2], M. Esposito[1], R. Marzella[2], and M. Giordano[1][2]
[1]Institute for Composite and Biomedical Materials, CNR, Portici, NA, Italy
[2]Imast, Portici, NA, Italy

A quasi static indentation test on a laminate composite has been investigated numerically and experimentally. In particular, the test has been implemented by COMSOL Multiphysics® and optimizing the Finite Element and mesh. In addition, the numerical strain results have been validated by the comparison with the respective experimental deformation data that have been obtained by fiber Bragg ...

Modeling of Vickers indentation of TiAl alloys

G. Maizza, and R. Cagliero
Politecnico di Torino, Corso Duca degli Abruzzi 24, Torino, Italy

Instrumented indentation is increasingly used as an alternative non-destructive test method to measure mechanical properties of small volumes of materials. In this work, the instrumented indentation test is applied as a non-destructive method to assess the mechanical properties of TiAl components during the setup of a real production process. This study is a preliminary contribution devoted to ...

Time-Dependent Thermal Stress and Distortion Analysis During Additive Layer Manufacturing, by Powder Consolidation by Laser Heating

M.S. Yeoman[1], J. Sidhu[2]
[1]1. Continuum Blue Ltd., Tredomen Innovation & Technology Park, Tredomen, Ystrad Mynach, United Kingdom
[2]BAE Systems, Advanced Technology Centre, Bristol, United Kingdom

A time-dependent COMSOL Multiphysics model of an additive manufacture process, which uses powder consolidation by laser heating was developed, providing a platform to better understanding the manufacture process & provide a tool to reduce resulting distortion & optimization of an additive manufacture process. The model simulates a high intense laser energy source moving along a pre-defined time ...

A Study of Thermal Stress Distribution Produced During MEMS Packaging

V. Sharma[1], A. K. Jayanthy[1], J. G. Baruah[1], J. V. Prabhu[1], K. Balakrishnan[1]
[1]SRM University, Chennai, Tamil Nadu, India

The analysis performed is categorized into two levels: 1. The thermal stress distribution on the sensing part with the variation in the substrate three glass material with appropriate dimensions and exposures. The reason behind this consideration of different materials is test the compatibility with the crystal. This variation in substrate material and its material properties shows which is ...