Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Design of a Miniaturized RF MEMS Based Single-Bit Phase Shifter

A. Chakraborty, A. Kundu, S. Chatterjee, and B. Gupta
Jadavpur University
Kolkata
West Bengal, India

This paper presents a novel design of single-bit RF MEMS phase shifter. The basic novelty introduced for phase shifter design in this case, is by scaling down of the lateral dimensions of the conventional RF MEMS shunt switch by 10 times. The Mechanical and Electromechanical analysis of the designed miniature RF MEMS fixed-fixed beam is performed using COMSOL Multiphysics v.3.5a as an FEM ...

Time-Dependent Thermal Stress and Distortion Analysis During Additive Layer Manufacturing, by Powder Consolidation by Laser Heating

M.S. Yeoman[1], J. Sidhu[2]
[1]1. Continuum Blue Ltd., Tredomen Innovation & Technology Park, Tredomen, Ystrad Mynach, United Kingdom
[2]BAE Systems, Advanced Technology Centre, Bristol, United Kingdom

A time-dependent COMSOL Multiphysics model of an additive manufacture process, which uses powder consolidation by laser heating was developed, providing a platform to better understanding the manufacture process & provide a tool to reduce resulting distortion & optimization of an additive manufacture process. The model simulates a high intense laser energy source moving along a pre-defined time ...

Modeling the Temperature-Dependent Dynamic Behavior of a Timber Bridge with Asphalt Pavement

B. Weber[1]
[1]Empa, Swiss Federal Laboratories for Materials Science and Technology, Dübendorf, Switzerland

The fundamental frequency and the corresponding damping value are the main design parameters for footbridges against excessive vibrations induced by pedestrians. Since pedestrians typically walk at a pace of 1.6–2.4 Hz, this frequency range as well as the range of the second harmonic, namely 3.5–4.5 Hz, should be avoided. However it has been observed that the fundamental frequency of a bridge ...

Modeling Flow and Deformation during Hot Air Puffing of Single Rice Kernels

T. Gulati[1], A. Datta[1]
[1]Cornell University, Ithaca, NY, USA

When rice is subjected to intense heating, it results in rapid evaporation of liquid water to vapor. As a consequence, large pressures are generated within the kernel in a span of 15s resulting in large volume changes causing the kernel to puff rapidly. Under suitable conditions, the ratio of initial volume to volume after puffing could be as high as 10. Rice puffing process is a complex ...

Utilization of COMSOL Multiphysics® Java API for the Integration of Composite Material Properties Through a Customized User Interface - new

R. Malav[1]
[1]Indian Institute of Technology Madras, Chennai, Tamil Nadu, India

Introduction: Usage of Composite Materials properties is rapidly gaining acceptance in various industries such as aircraft manufacturing, automotive, healthcare, etc. Its main strengths are light weight material, great strength and durability, strength related to weight, corrosion resistance and design flexibility. In the process of modeling and simulation, many a time a user wants to use ...

Micromechanical Design of Novel Thermal Composites for Temperature Dependent Thermal Conductivity - new

R. C. Thiagarajan[1],
[1]ATOA Scientific Technologies Pvt. Ltd., Bengaluru, Karnataka, India

Materials with an order variable in thermal conductivity as a function of temperature are desirable for thermoelectric heat energy recovery, building thermal insulation and solar thermal applications. Thermal Conductivity is an inherent material property. Engineering the fundamental thermal conductivity needs manipulation at thermal photon level for conventional materials. Engineering thermal ...

Modelling of Lintel-Masonry Interaction Using COMSOL

A. Vermeltfoort, and A. van Schijndel
Eindhoven University of Technology, Netherlands

An attempt was made, as described in this paper, to assign material properties like shear strength and modulus of elasticity randomly. In this way, the behaviour of a masonry wall with a prefabricated concrete lintel was experimentally tested and simulated using COMSOL. The paper confirms the possible use of COMSOL for modelling lintel-masonry interaction, including variation of mechanical ...

Dynamics of Slender Structures

K. Lund
Kurt Lund Consulting, Del Mar, CA , USA

The present work formulates the dynamics of a slender structure as a long beam. This results in a PDE that is fourth-order in space, and second order in time. In COMSOL the coupling method is used to decompose this problem into two second-order equations, one for displacements, and one for bending moments, which are then solved to obtain frequencies and mode shapes. For verification of ...

Designing Materials for Mechanical Invisibility Cloaks

P. Olsson[1], F. Larsson[1], A. Khlopotin[1], S. Razanica[1]
[1]Chalmers University of Technology, Gothenburg, Sweden

In solid mechanics, there is considerable interest in achieving “invisibility”. The applications in mechanics include protection of structures and parts of structures from potentially harmful transient waves and steady state vibrations. A suggested large scale application is that protection against seismic waves from earthquakes could be achieved by using cloaking to re-route the waves around ...

Evaluation of Low-Cycle-Fatigue Life of Solder Joints in Surface Mounting Power Devices by Finite Element Modeling

N. Delmonte[1], F. Giuliani[1], M. Bernardoni[2], P. Cova[1]
[1]Dipartimento di Ingegneria dell'Informazione, Università degli Studi di Parma, Parma, Italy
[2]CDTR - Centre for Device Thermography and Reliability, H. H. Wills Dept. of Physics, University of Bristol, Bristol, United Kingdom

The reliability of solder joints [1,2] is one of the key factors in the determination of the reliability of the high power density electronic converters, being the solder joints both the mechanical, the electrical, and often the thermal connections between the electronic component and the board in which the component is placed. The main mechanism by which solder joints are damaged is thermal ...

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