Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Design and Simulation of a Microscale Magnetophoretic Device for the Separation of Nucleated Fetal Red Blood Cells from Maternal Blood

G. Schiavone[1], D.M. Kavanagh[2], and M.P.Y Desmulliez[2]

[1]Politecnico di Torino, Torino, Italy
[2]MIcroSystems Engineering Centre, School of Engineering & Physical Sciences, Heriot-Watt University, Edinburgh, Scotland, United Kingdom

Intense research has been carried out into methods that aim at harvesting fetal cells from maternal blood as substitutes to amniocentesis and chorionic villus sampling. This work focuses on the separation of fetal nucleated red blood cells from the maternal circulation based on their intrinsic magnetic properties. The design and simulation of a magnetophoretic separator is described, as it will ...

Coupling Miscible Flow and Geochemistry for Carbon Dioxide Flooding into North Sea Chalk Reservoir

B. Niu[1], W. Yan[1], A.A. Shapiro[1], and E.H. Stenby[1]

[1]Department of Chemical and Biochemical Engineering, Technical University of Denmark, Kgs. Lyngby, Denmark

As an effective method to cope with green-house gas emission, and to enhance oil recovery, injection of carbon dioxide into oil reservoirs has obtained increasing attentions. The flooding process involves complex phase behavior among oil, brine and CO2, and geochemical reaction between CO2 and rock. COMSOL Multiphysics® was first applied to simulating two flooding processes with known ...

3D Simulation of the Thermal Response Test in a U-tube Borehole Heat Exchanger

L. Schiavi[1]

[1]Dipartimento di Ingegneria Industriale, Università di Parma, Parma, Italy

Simulated Thermal Response Test (TRT) data are analyzed in order to evaluate the effect of the tridimensionality model’s feature in determining the proper value of the soil thermal conductivity and borehole thermal resistance. The 3D system’s simulation during the TRT is realized by adopting the finite element method. The comparison of the numerical results with the analytical ...

Modelling Waste Water Flow in Hollow Fibre Filters

I. Borsi[1] and A. Fasano[1]
[1]Dipartimento di Matematica U. Dini, Università di Firenze, Firenze, Italy

In this paper we present a model to describe the process of waste water filtration based on hollow-fibre membrane filters. In particular, we deal with membranes whose pores diameter is in the range 0.01-0.1 µm. The main problem in these filtering systems is the membrane fouling. The mathematical model consists in two equations for the Darcy's flow through the filter, coupled with an ...

Modeling of Silicon Transport into Germanium Using a Simplified Crystal Growth Technique

F. Mechighel[1][3], B. Pateyron[1], M. El Ganaoui[1], S. Dost[2], and M. Kadja[3]

[1]Laboratory SPCTS UMR CNRS, ENSCI, Limoges University, Limoges, France
[2]Crystal Growth Laboratory, Department of Mechanical Engineering, University of Victoria, British Columbia, Victoria, Canada
[3]Department of Mechanical Engineering, University of Constantine, Constantine, Algeria

A numerical simulation study, using COMSOL Multiphysics®, was carried out to examine the temperature and concentration fields in the dissolution process of silicon into germanium melt. This work utilized a simplified configuration which may be considered to be similar material configuration to that used in the Vertical Bridgman growth methods. The concentration profile for the SiGe sample ...

Large Scale Outdoor Flammable & Toxic Gas Dispersion Modelling in Industrial Environments

A. Hallgarth[1], A. Zayer[1], A. Gatward[2], and J. Davies[2]

[1]Hazard Research & Risk Consultants Ltd, Aberystwyth, Wales, United Kingdom
[2]Independent Consultants, United Kingdom

HazRes has developed a gas discharge and dispersion model in COMSOL which takes into account the effects of localized wind profiles and turbulence generated by buildings, structures and terrain on the dispersion of gases in question. The main focus of this work is to develop and provide clients with more accurate prediction methods relative to industrial standard software tools in modeling ...

Numerical Modeling of Resistance Welding Process in Joining of Thermoplastic Composite Materials Using COMSOL Multiphysics®

R. Carbone[1] and A. Langella[1]
[1]Material and Production Engineering Department, Università degli Studi di Napoli Federico II, Napoli, Italy

This paper deals of a technology involved in the joining of thermoplastic composites, the resistance welding technology. This process takes advantage in the repeatable melting process for the thermoplastic resins. The process was numerically modeled to study the effect of the two main process parameters, the electric power density applied to the heating elements and the exposure time at the ...

Calculating Power Loss of Contactless Power Transmission Systems with Ferrite Components

S. Hanf[1] and D. Kürschner[1]
[1]Institut für Automation und Kommunikation Magdeburg, Magdeburg, Germany

In this paper a methodology for calculating loss within contactless inductive power transmission systems, resulting from hysteresis and eddy current effects, is presented. The usage of the mathematical models of Stoll and Steinmetz for the determination of core loss with COMSOL is explained. Apart from the metrological verification of selected aspects of power loss, the results of a parametrical ...

Simulation of Daisy Chain Flip-Chip Interconnections

G.S. Durante[1] and M. Fretz[1]

[1]CSEM Zentralschweiz, Alpnach Dorf, Switzerland

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive adhesive (ACA) bonding, and AuSn20 eutectic solder. The single bumps were then measured with a high precision ...

3-D COMSOL Analysis of Extruder Dies

E. Solomon[1] and V. Mathew[1]
[1]Arcada University of Applied Sciences, Espoo, Finland

Three-dimensional flow analysis was performed by using COMSOL Multiphysics Chemical Engineering Module for the purpose of analyzing the flow properties and finding out the operating points of a test domain. Using material property table for an exemplary melt of LDPE (Low-Density Polyethylene), the logarithmic viscosity-shear rate graph was plotted and fitted to the 4–constant modified Carreau ...

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