Technical Papers and Presentations

Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

A Modular Platform for Cell Characterization, Handling, and Sorting by Dielectrophoresis

S. Burgarella[1], B. Dell’Anna[2], V. Perna[1], G. Zarola[2], and S. Merlo[2]

[1]STMicroelectronics, Agrate Brianza, MI, Italy
[2]Dipartimento di Elettronica, Università degli Studi di Pavia, Pavia, Italy

Dielectrophoresis (DEP) is a method for cell manipulation without physical contact in lab-on-chip devices, since it exploits the dielectric properties of cells suspended in a microfluidic sample, under the action of locally generated high-gradient electric fields. The DEP platform that has been developed offers an integrated solution for customizable applications. Several functional units, ...

Safe Storage Parameters During CO2 Injection Using Coupled Reservoir-Geomechanical Analysis

T.I. Bjørnarå[1], E. Aker[1], and E. Skurtveit[1]
[1]NGI, Oslo, Norway

Safe short term storage of CO2 depends mainly on structural and solubility trapping. On longer term, mineral trapping is also contributing to the trapping of CO2. To be able to investigate the importance of these different storage mechanisms, a finite element model for simulation of CO2 injection has been developed in COMSOL Multiphysics®. The model describes and solves for two-phase flow ...

Thermal Design of Power Electronic Devices and Modules

N. Delmonte[1], M. Bernardoni[1], P. Cova[1], and R. Menozzi[1]
[1]Dipartimento di Ingegneria dell’Informazione, University of Parma, Parma, Italy

This work describes a way to apply 3D Finite Element Analysis (FEA) to the thermal design of power electronic modules using simplified geometry models of the system components. The method here presented can overcome the problem of solving equation systems with a very high number of Degrees Of Freedom (DOF) due to complex geometry of a power module.

COMSOL Multiphysics® Enhances Design Process at e2v technologies

Jan Przybyla
Technical Specialist, e2v technologies, England

Outline of presentation: We have seen a few of the diverse ways e2v has started to use COMSOL It is allowing us to view our processes in a different way Resulting in improvements It is enabling our engineers and scientists to examine the full application, not just the microwave or RF tube Resulting in: Complete product solution -with much added value Expected considerable growth in ...

Multiphase, Dual Polymer Injection Molding and Cooling of an Open Cavity to Form both Distinct and Graduated Material Properties within a Complex Three-Dimensional Body

M.S. Yeoman[1]
[1]Continuum Blue Ltd, Forest Row, United Kingdom

With the advancement of medical devices and implants, many now require more advanced nonlinear, hyper-elastic materials such as elastomers to be extensively utilized in the body. This combined with the need to allow for considerably different, varying and graduated material responses within the three-dimensional device, poses a difficult challenge to manufacturing an elastomeric implant in a ...

Fatigue Damage Evaluation on Mechanical Components under Multiaxial Loadings

R. Tovo[1] and S. Capetta[1]
[1]Dipartimento di Ingegneria, Università degli Studi di Ferrara, Ferrara, Italy

This paper is concerned with the fatigue behavior of complex, three-dimensional, stress concentrations under multiaxial loadings. Starting from the stress field obtained from a linear elastic analysis and taking advantage of the so-called implicit gradient approximation, an effective stress index connected with the material strength is calculated. Besides, this work summarizes a first ...

Finite Element Modeling for the Mechanical Behavior of Silicon Diaphragms Using COMSOL Multiphysics®

J. Ren[1], M. Ward[1], Peter Kinnell[2], and Russell Cradock[2]

[1]School of Mechanical Engineering, University of Birmingham, Birmingham, United Kingdom
[2]GE Druck Limited, Fir Tree Lane, Leicester, United Kingdom

The silicon diaphragm is one of the most common structures in Micro-Electromechanical Systems (MEMS). However, it is susceptible to creep deformation at elevated temperatures. This paper presents a transient finite element model which simulates the mechanical behavior of the micromachined silicon diaphragms at the temperature of 900 °C. The constitutive equations proposed by Alexander and ...

Local Conduction Heat Transfer in U-pipe Borehole Heat Exchangers

J. Acuna[1] and B. Palm[1]

[1]Department of Energy Technology, KTH, Stockholm, Sweden

The most common way to exchange heat with the bedrock in Ground Source Heat Pump (GSHP) applications is circulating a fluid through a U-formed closed loop in vertical boreholes drilled several tenths of meters into the ground. This study presents and compares the results of eight cross sectional U-pipe Borehole Heat Exchanger configurations. Values from recent experimental temperature ...

Fast 2D Simulation of Superconductors: A Multiscale Approach

V.M. Rodriguez-Zermeno[1], M.P. Sørensen[1], N.F. Pedersen[2], N. Mijatovic[2], and A.B. Abrahamsen[3]
[1]DTU Mathematics, Lyngby, Denmark
[2]DTU Electrical Engineering, Lyngby, Denmark
[3]Materials Research Division, Risø, DTU, Roskilde, Denmark

This work presents a method to calculate AC losses in thin conductors such as the commercially available second generation superconducting wires through a multiscale meshing technique. The main idea is to use large aspect ratio elements to accurately simulate thin material layers. For a single thin superconductor, several standard test cases are simulated including transport current, externally ...

Modeling of a DBD Reactor for the Treatment of VOC

L. Braci[1], S. Ognier[1], and S. Cavadias[1]
[1]Laboratoire de Génie des Procédés Plasmas et Traitements de Surfaces, Ecole Nationale Supérieure de Chimie de Paris, University Pierre et Marie Curie, Paris, France

Non-thermal plasma, generated in atmospheric pressure discharges, has been investigated in our laboratory in order to treat highly diluted (300 ppm to 1000 ppm) volatile pollutant. The collision of electrons created in the discharge with atmospheric air, leads to the formation of reactive species that can totally or partially oxidize the pollutants at near ambient temperature. The purpose of the ...

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