Multiphysics Modeling of Semiconductors, Part 3: Surface Processing

High-precision surface processes, such as plasma-enhanced chemical vapor deposition (PECVD) and etching, are critical steps in the fabrication process of cutting-edge semiconductor chips and microelectromechanical systems (MEMS). In this webinar, we will explore how multiphysics modeling can be used to improve understanding, predict performance, and enable design optimization during the design stage of industrial PECVD and etch reactors.

We will also showcase two new example models and new functionality from the Plasma Module, an add-on to COMSOL Multiphysics®, for simulating nonequilibrium plasma physics in inductively and capacitively coupled plasma reactors, including a fully coupled multiphysics approach incorporating plasma physics, electromagnetic, fluid flow, and thermal simulations, as well as detailed surface chemistry and etching/deposition rate prediction.

This is the third webinar in a three-part series showcasing the capabilities of COMSOL Multiphysics® relevant to the semiconductor industry.