Application ID: 44481
This example illustrates the principle of wet chemical etching for 2D geometry under laminar flow. The purpose of this tutorial is to examine how the copper substrate material is depleted and how the cavity shape evolves during the wet etching process. Wet chemical etching is particularly important for microelectronics industry for patterning of integrated circuit, MEMS devices, optoelectronic and pressure sensors. Wet etching processes use solution based (“wet”) etchants, where the substrate to be etched is immersed in a controlled flow of etchant.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.