Parameterized Electronic Enclosure Geometry
Application ID: 6222
This study simulates the thermal behavior of a computer Power Supply Unit (PSU). Most of such electronic enclosures include cooling devices to avoid electronic components to be damaged by excessively high temperatures. In this model, an extracting fan and a perforated grille cause an air flow in the enclosure to cool internal heating.
This application was built using the following:Heat Transfer Module
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