The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
A typical capacitor is composed of two conductive objects with a dielectric in between them. A voltage difference applied between these objects results in an electric field between them. This electric field exists not just directly between the conductive objects, but extends some ... Read More
This example models the deposition of an inductor coil in 3D. The geometry includes the extrusion of the deposition pattern into an isolating photoresist mask, and a diffusion layer on top of the photoresist. The mass transfer of copper ions in the electrolyte has a major impact on the ... Read More
In this set of eight tutorial models and associated documentation, you can investigate the resistive, capacitive, inductive, and thermal properties of a standard three-core lead-sheathed XLPE HVAC submarine cable with twisted magnetic armor (500 mm2, 220 kV). The series includes a 2D, 2D ... Read More
The present model example is based on Copper Deposition in a Trench model available in Electrodeposition Application Library. The nonuniform deposition along the trench surface leads to formation of a cavity/void. Since the Deformed Geometry interface cannot handle topological changes, ... Read More
The model performs a static analysis on a piezoelectric actuator based on the movement of a cantilever beam, using the Piezoelectric Devices predefined multiphysics interface. Inspired by work done by V. Piefort and A. Benjeddou, it models a sandwich beam using the shear mode of the ... Read More
This model extracts spice parameters for a silicon p-n junction diode. The spice parameters are used to create a lumped-element equivalent circuit model of a half-wave rectifier that is compared to a full device level simulation. In this example, a device model is made by connecting a 2D ... Read More
This example simulates electroplating of a printed circuit board (PCB) in 3D using the Secondary Current Distribution interface. In order to achieve thickness uniformity across the PCB, a dummy pattern is included in the design, along with an aperture in the electroplating bath. Read More
This example demonstrates how an ESD event causes logic error of a microchip on a PCB board. The ESD current is based on the extended HBM (Human Body Model) and it is predefined in the Lumped Port feature. Read More
Battery electrodes featuring large heterogeneities in terms of particle sizes may sometimes not be adequately described by homogenized models using one single particle size only. As an alternative to adding multiple instances of the Additional Porous Electrode material node, this ... Read More
In this model, the effect of corrosion product on galvanic corrosion between a magnesium alloy (AE44) and mild steel in contact with brine solution is presented, wherein deformed boundaries due to both deposition of corrosion product as well as dissolution of magnesium are considered. ... Read More