The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
In direct bonding, particulate contamination at the interface can significantly reduce bonding quality. Even micron-scale particles may prevent local contact and lead to large interfacial voids. This model demonstrates a 3D simulation workflow for die-to-wafer (D2W) direct bonding. The ... Read More
In semiconductor manufacturing, vacuum chucks are used to rapidly and contamination-free adsorb and secure wafers before processes such as transfer, lithography, and inspection. Traditional empirical design makes it difficult to quantify the effects of groove shape, size, distribution, ... Read More
PCB is fabricated by laminating multiple materials, such as FR-4, copper, and resin, which exhibit significantly different coefficients of thermal expansion (CTE). When subjected to heating, the differential thermal expansion among these layers induces interlaminar deformation mismatch, ... Read More
This model showcases a nail penetration experiment into a layered battery. The analysis couples solid mechanics, electric currents, and heat transfer to capture the response during penetration. A metallic nail is driven into a sandwiched battery structure composed of two electrodes and a ... Read More
In this model, the stress concentrations around a superelliptic hole in a thin plate are investigated. To learn more about this model, see our accompanying blog post “Stress Concentrations Around a Superellipse”. Read More
