The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
This example illustrates a linear buckling analysis conducted for a corrugated conical shell, utilizing a single sector of the geometry along with cyclic symmetry periodicity edge conditions. The results are compared to those using the full shell geometry. Read More
The homogenized material properties of a composite are computed based on the temperature-dependent properties of matrix and fiber. The homogenized parameters are compared to the analytical values derived from the rule of mixtures. This is an extension of model https://www.comsol.com ... Read More
This model showcases a nail penetration experiment into a layered battery. It couples the Solid Mechanics, Lithium-Ion Battery, and Heat Transfer interfaces. A nail is punched into a sandwiched battery consisting of two electrodes and a separator. As soon as the nail connects both ... Read More
This is a demo model to show how to model connections in a mechanical system using Multibody Dynamics interface. In this model, pantograph mechanism is modeled. The purpose of this mechanism is to produce an identical, either enlarged or miniaturized, copy of an existing drawing. Read More
In this model, the stress concentrations around a superelliptic hole in a thin plate are investigated. To learn more about this model, see our accompanying blog post “Stress Concentrations Around a Superellipse”. Read More
This model demonstrates how to extract the lumped parameters for an mBVD equivalent circuit from a FEM simulation and how to leverage such a model directly using the Electrical Circuit interface. A 3D layered FBAR resonator is considered as an example. Related Blog Post Leveraging the ... Read More
In direct bonding, the in-plane relative displacement between corresponding points on the bonding surfaces of the top and bottom wafers, denoted as IPD (In-Plane Distortion), is the primary yield killer in the bonding process. This model can predict the entire direct wafer bonding ... Read More
Flip chip (FC) is a widely-used form of advanced semiconductor packaging, which yields small size, high interconnection density, and good signal transmission performance of the semiconductor device. In FC devices, the chip is placed face down and directly bonded to the substrate, or ... Read More
