The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
In this tutorial example, the concepts of Component Mode Synthesis (CMS) are introduced through a simple solid model of a cantilever beam. Parts of the beam are reduced by the CMS technique. It is, furthermore, shown how CMS can be used to represent both the static and dynamic behavior ... Read More
In this example, the homogenized elastic and viscoelastic properties of a particulate composite are computed based on the individual properties of elastic particles embedded in a viscoelastic matrix. Periodic boundary conditions are applied to a unit cell of the particulate composite ... Read More
In this example, the micromechanical properties of a piezoelectric fiber composite are studied. The homogenized electromechanical properties of the composite are derived from the individual microscopic properties of matrix and fiber. Read More
The thermal stress in a layered plate is studied in this example. A plate consisting of two layers, a coating and a substrate layer, is stress and strain free at 800 degrees C. The temperature of the plate is reduced to 150 degrees C and thermal stresses are induced due to the difference ... Read More
In this parameter optimization example, the mass of a bracket is minimized by changing the size and position of a number of geometrical objects. The requirements give limits both on the lowest natural frequency, and on the maximum stress in a static load case. This means that results ... Read More
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... Read More
This example shows how to model prestressed bolts. The bolt geometry is taken from the Part Libraries. For comparison, one of the bolts is modeled using a thread contact formulation, whereas the other bolt is connected to the bolt hole by a pure continuity condition. The reduced ... Read More
In his example, the lowest natural frequency of a 3D bracket are maximized using shape optimization. Read More
These examples demonstrate how to generate randomized geometric surfaces. Note that there is now also an add-in covering random surface functionality for planar surfaces. The COMSOL Multiphysics® software provides a powerful set of built-in functions and operators, such as ... Read More
In this example, the External Stress feature in the Solid Mechanics interface is used to provide the material model with the nonsymmetric stress required in the design of an elastic invisibility cloak. The cloak is a domain with special material properties aimed at shielding a region of ... Read More
