Residual Stresses in a Panel Manufactured Using EBF3 ProcessJ. Gaillard, D. Locatelli, S. Mulani, and R. Kapania
Microelectronics and Micromechanics Department, Engineering school of ENSICAEN (Ecole National Superieure d'Ingénieurs de Caen), Caen, France
 Engineering Science and Mechanics Department, Virginia Polytechnic Institute and State University, Blacksburg, Virginia, USA
 Aerospace and Ocean Engineering Department, Virginia Polytechnic Institute and State University, Blacksburg, Virginia, USA
The residual stresses developed in a stiffened panel manufactured using Electron Beam Freeform Fabrication (EBF3) process were studied. EBF3 process is a layer additive process that can be used to build near-net shaped parts directly using computer controlled techniques, which can be used for aerospace structures.
A COMSOL model was created to simulate the residual stresses using a thermo-mechanical analysis, with the Goldak’s semi ellipsoidal moving heat source. The obtained results indicate that residual stresses are under the yield strength of the material used.