Thermal Design of Power Electronic Devices and ModulesN. Delmonte, M. Bernardoni, P. Cova, and R. Menozzi
Dipartimento di Ingegneria dell’Informazione, University of Parma, Parma, Italy
This work describes a way to apply 3D Finite Element Analysis (FEA) to the thermal design of power electronic modules using simplified geometry models of the system components. The method here presented can overcome the problem of solving equation systems with a very high number of Degrees Of Freedom (DOF) due to complex geometry of a power module.