See How Multiphysics Simulation Is Used in Research and Development
Engineers, researchers, and scientists across industries use multiphysics simulation to research and develop innovative product designs and processes. Find inspiration in technical papers and presentations they have presented at the COMSOL Conference. Browse the selection below or use the Quick Search tool to find a specific presentation or filter by application area.
View the COMSOL Conference 2023 Collection
Numerical Analysis of Conjugate Heat Transfer in Foams
A conjugate conductive-convective-radiative discrete model useful for the study and the simulation of heat transfer in a ceramic or metallic foam is presented. A Generation-based Technique is used for the foam representation, using the Weaire-Phelan structure and heat transfer is studied ... Read More
Designing of End-winding Corona Protection of Generators by Help of Simulation
The job of designing end-winding corona protection (ECP) system is one of the very important and complex phases for insulation configuration of high voltage rotating machines. This complexity stems on one hand from the highly nonlinear characteristics of the ECP material and on the other ... Read More
Thermoacoustic Analysis of Combustion Instability Importing RANS Data
A hybrid technique based on the use of the FEM and the transfer matrix method is used to identify the frequencies at which thermoacoustic instabilities are expected and the growth rate of the pressure oscillations at the onset of instability. The Helmholtz equation is used to model the ... Read More
Design of a Stealth Antenna Using COMSOL Multiphysics
This paper will describe some applications of COMSOL Multiphysics to the analysis of Frequency Selective Surface (FSS) structures. Particular attention will be devoted to the possibility of designing a stealthy antenna using the FSS structure. In fact, since it possesses a dual filter ... Read More
A Model of Electric Field Assisted Capillarity for the Fabrication of Hollow Microstructures
Electric Field Assisted Capillarity (EFAC) is a novel technique for the fabrication of hollow polymer microstructures. It has advantages over current methods as it is a single step process. Hollow microstructures have many uses in industry from microchannels and microcapsules in BioMEMS ... Read More
Coupled Electric-Thermal-Fluid Analysis of High Voltage Bushing
Modern power transmission systems are in general designed to operate at high voltages in order to reduce resistive losses generated by high currents. This, however, tends to increase the risk for dielectric breakdown or flashovers if the equipment is not properly designed to withstand ... Read More
Numerical Investigation of the Convective Heat Transfer Enhancement in Coiled Tubes
The work is focused on the numerical analysis of forced convection in curved tubes investigating the correlation between the heat transfer and friction factor enhancement and the effects of the wall curvature. The analysis was performed by integrating the continuity, momentum and energy ... Read More
Thermo-Acoustic Analysis of an Advanced Lean Injection System in a Tubular Combustor Configuration
In this work a thermoacoustic analysis of a tubular combustor with an advanced lean injection system is presented. The performed analysis is based on the resolution of the eigenvalue problem related to an inhomogeneous wave equation which includes a source term representing heat release ... Read More
Electrical and Thermal Analysis of an OLED Module
This paper presents the electrical and thermal analysis of an OLED module. The OLED module consists of the OLED tile and the DC-DC converter incorporated in its backplane. The DC-DC converter is realized as an integrated circuit and its inductor is embedded in the the backplane. The DC ... Read More
Multiphysics Simulations for the Design of Probe-Heads Micro-Needles
The paper presents recent results concerning the experimental mechanical characterization, the numerical modeling and the design of micro-needles used in the construction of probe heads for wafer testing. A fully coupled electro-thermal model was created using COMSOL and combined to a ... Read More