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See How Multiphysics Simulation Is Used in Research and Development

Engineers, researchers, and scientists across industries use multiphysics simulation to research and develop innovative product designs and processes. Find inspiration in technical papers and presentations they have presented at the COMSOL Conference. Browse the selection below or use the Quick Search tool to find a specific presentation or filter by application area.

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Bengaluru 2023

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2014 - Cambridgex

Influence of Air Gap Length and Cross-Section on Magnetic Circuit Parameters

A. Polit[1], R. Jez[1]
[1]ABB Corporate Research Center, Krakow, Poland

The air gap is one of the most crucial part of magnetic circuits, especially in high-power inductors. It significantly modifies the parameters of magnetic devices by increasing the saturation current, linearizing B-H curve of magnetic circuit and causing a decreasing in the inductance. ... Read More

Numerical Modeling of Sampling Airborne Radioactive Particles Methods from the Stacks of Nuclear Facilities in Compliance with ISO 2889

P. Geraldini[1]
[1]Sogin Spa, Rome, Italy

The main objective of this study is to verify the compliance of an ongoing nuclear facilities stack design with the ISO 2889 requirements, during normal and off-normal conditions. In particular, with the numerical simulations, they have been identify well-mixed sample locations along the ... Read More

Acoustic Wave Propagation in Water Filled Buried Polyethylene Pipes

T. Graf[1], T. Gisler[1], P. Sollberger[1], O. Schaelli[1]
[1]School of Engineering and Architecture, Lucerne University, Horw, Switzerland

Axisymmetric acoustic waves propagating along buried water pipes have been investigated by FEM and experimentally. Universal dispersion relations of the fundamental mode were obtained as a function of the standard dimension ratio SDR and of the material surrounding the pipe (soil, air). ... Read More

Modelling of Heat and Moisture Transport in a Corrugated Board Stack

M. Xynou[1]
[1]KTH Royal Institute of Technology, Stockholm, Sweden

Corrugated board is produced on a machine where the corrugated medium is glued between two flat paper surfaces, the liners. The board is cut into sheets and stored in a stack until suitable moisture content has been reached. The sheets are then cut and creased into blanks for the ... Read More

Field Joint Coatings for Deep Sea Pipelines

R. Verhelle[1], L. Van Lokeren[1], S. Loulidi[1], H. Boyd[2], G. Van Assche[1]
[1]Physical Chemistry & Polymer Science, Vrije Universiteit Brussel, Brussels, Belgium
[2]Heerema Marine Contractors, Leiden, The Netherlands

COMSOL Multiphysics® software is used to model the field joint application process on carbon steel pipelines for deep sea crude oil transportation, taking into account not only heat transfer, cure kinetics, and crystallization, but also thermal, cure and crystallization shrinkage and the ... Read More

Modeling of Noise Produced by Offshore Wind Turbines with Different Foundations and Effects on the Marine Environment

B. Marmo [1], I. Roberts [1]
[1]Xi Engineering Consultants, Edinburgh, Scotland, UK

Vibration produced by offshore wind turbines during their normal operation transmits through the tower into the foundation where it interacts with the surrounding water and is released as noise. The noise produced by offshore wind turbines can be detected by fish and marine mammals and ... Read More

Simple Finite Element Model of the Topografiner

H. Cabrera[1], D. A. Zanin[1], L. G. De Pietro[1], A. Vindigni[1], U. Ramsperger[1], D. Pescia[1]
[1]Laboratory for Solid State Physics, ETH Zürich, Zürich, Switzerland

In our recent experiments we are revisiting the topografiner technology for the imaging of surface topography with a resolution of a few nanometers. In these new technique called Near-Field Emission Scanning Electron Microscopy (NFESEM), low-energy electrons are emitted from a ... Read More

Void Shape Evolution of Silicon: Level-Set Approach

C. Grau Turuelo[1], C. Breitkopf[1]
[1]Technische Universität Dresden, Dresden, Germany

The void shape evolution of silicon is a process driven mainly by surface diffusion which leads to a geometrical transformation of trenches etched in silicon wafers due to surface energy minimization. The temperature, the ambient gas and the annealing time affect the velocity of the ... Read More

Heterodimensional Charge-Carrier Confinement in Sub-Monolayer InAs in GaAs

S. Harrison[1], M. Young[1], M. Hayne[1], P. D. Hodgson[1], R. J. Young[1], A. Strittmatter[2], A. Lenz[2], U. W. Pohl[2], D. Bimberg[2]
[1]Department of Physics, Lancaster University, Lancaster, UK
[2]Institut für Festkörperphysik, Berlin, Germany

Low-dimensional semiconductor nanostructures, in which charge carriers are confined in a number of spatial dimensions, are the focus of much solid-state physics research, offering superior optical and electronic properties over their bulk counterparts. Both two-dimensional (2D) and zero ... Read More

Web-Based 3D Visualization for COMSOL Multiphysics® Software

S. Grabmaier[1], M. Jüttner[1], W. M. Rucker[1]
[1]University of Stuttgart – Institute for Theory of Electrical Engineering, Stuttgart, Germany

A web based visualization solution for three dimensional simulation results of COMSOL Multiphysics® is described. With it, mobile clients with low bandwidth as well as desktop computers with high bandwidth connections get able to show simulation results without the need of installing ... Read More

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