COMSOL Conference 2026 Proceedings
Collection of Papers, Posters, and Slideshows Accepted by the Program Committee
At the COMSOL Conference 2026, engineers, researchers, and scientists from around the globe showcased their use of modeling and simulation across all major industries and in academia. Use the Quick Search tool to find a specific presentation or filter by topic or event location.
Hyperloop is a theoretical high-speed mass transportation system which aims to increase efficiency through the use of low-pressure tunnels and contactless propulsion. The University of Edinburgh’s Hyperloop Team (HYPED) has been selected to participate in the SpaceX Hyperloop Pod ... Read More
This paper assesses the capability and sensitivity of COMSOL Multiphysics® to evaluate phase-changing material suitability for Thermal Energy Storage. The simulated system is a packed bed of encapsulated spheres, containing phase changing materials (PCM), placed inside a single ... Read More
Transcutaneous electrical nerve stimulation is a non-invasive method of treating patients who have indication of pain. This therapy depends on electrical current and pulse duration applied to electrodes of device. To develop the medical device for pain relief, we investigated a numerical ... Read More
What is Hyperloop? Hyperloop is a futuristic train transportation concept which functions on the principle of magnetic levitation, where arrays of magnets, known as Halbach arrays are used to generate lift and thrust for the pod. How COMSOL Multiphysics® Was Utilised? COMSOL ... Read More
The effects of an auxiliary resonating chamber in an in-ear headphone were simulated using COMSOL Multiphysics®. The auxiliary resonator consists of a rubber attachment that can be added to an in-ear loudspeaker. The purpose of the resonator is to increase the low frequency performance ... Read More
In biotechnology and medicine, cells are frequently grown on scaffolds with a three-dimensional channel structure. The oxygen and nutrient supply of the cells is realized by a medium flowing through the channels of the scaffolds. However, it is often difficult to obtain a confluent ... Read More
This abstract describes a COMSOL® App that has been created to perform thermal simulations of an electronics assembly. The assembly comprises fourteen components including a photonic integrated circuit (PIC), a printed circuit board assembly (PCBA), a thermoelectric cooling (TEC) Peltier ... Read More
Environmental factors such as temperature and humidity can significantly affect the quality of the metal powder used in power bed fusion additive manufacturing, leading to variations in the integrity of finished components. It is therefore important to monitor and minimize the exposure ... Read More
