Technical Papers and Presentations

Modelling 3D IC structures with Through Silicon Vias (TSVs) and micro bumps is a promising technique to achieve “more than Moore” integration. Conventionally, Copper (Cu) is used as a TSV material. However, due to rapid scaling of interconnect, problems like electro-migration and surface ... Read More

Lyophilization is a dehydration process used to preserve perishable material like food. It depends on many parameters like temperature, pressure, rate of drying, type of heating for sublimation, chamber size etc. Therefore, optimization of multiple parameters is required for design and ... Read More

Laser material processing at micro-meter domain can be used for a plethora of applications such as micro drilling, micro welding, micro cutting, micro-texturing as well as micro polishing. These processes are governed by the time varying, complex melt hydrodynamics courtesy of melting ... Read More

An accelerometer detects acceleration and tilt of a device. There are several areas where accelerometers are in use, e.g. aerospace, navigation, automotive industry, electronic gadgets etc. According to different working principle, there are different types of accelerometer, e.g. piezo ... Read More

This paper presents numerical investigation of electronic thermal control using heat sink for integrated circuit (IC) chip cooling under forced convection in a horizontal channel. Steady state, three dimensional, incompressible, laminar forced convection cooling of chip attached with ... Read More

This paper presents numerical investigation on heated blocks under natural convection in a vertical channel for heat transfer enhancement. Three dimensional, steady state, incompressible, laminar natural convection in a vertical channel have been studied. The problem is modeled and ... Read More

This paper investigates numerical simulation of electronic chips mounted on substrate of multilayer copper clad board (k = 40.5 W/m K) in a horizontal channel under laminar forced convection. The heat sinks made of aluminum ( k = 160 W/m K) is attached to the silicon chips in order to ... Read More

Working performance of an disconnector is affected by maximum permissible temperature which is caused by the ohmic heat losses of & eddy current losses. Since experimental testing is expensive & time consuming, a 3D thermal analysis model of double break rotating blade (DBRB) 33 ... Read More

Thermophysical measurements of the Moon gained importance in light of recent results from various instruments onboard lunar missions such as LRO, GRAIL and Chandrayaan-1. Although heat flow measurements will be of top priority for future in situ geophysical exploration of the Moon, no ... Read More

Additive manufacturing is attracting more and more interest. Laser Cladding is one of these additive manufacturing processes. As it is a blown powder process, here a melt pool formation & fusion by moving the laser beam, into which powder is blown and molten & surface tension gradient ... Read More