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Multiphysics modeling and simulation drives innovation across industries and academia — as is evidenced by the many uses showcased in the technical papers and posters presented by engineers, researchers, and scientists at the COMSOL Conference each year.

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Failure Modes of Underground MV Cables: Electrical and Thermal Modelling

P.A. Wallace[1], M. Alsharif[1], D.M. Hepburn[1], and C. Zhou[1]
[1]Department of Energy Systems Engineering, Glasgow Caledonian University, Glasgow, United Kingdom

Two simulations of the performance of a Paper Insulated Lead Covered (PILC) Medium Voltage (MV) underground cable are presented. The first presents the thermal response of a cable, over seven days, to a realistic load with a diurnal variation. The second concentrates on the variation of ... Read More

3D Electro-Thermal Study for Reliability of Automotive Power Vertical MOSFET Using COMSOL Multiphysics^®

T. Azoui[1], S. Verde[1][2], J.B. Sauveplane[1], and P. Tounsi[1]
[1]LAAS-CNRS, Toulouse, France
[2]Department of Electronics and Telecommunications Engineering, University of Naples Federico II, Naples, Italy

In this paper 3D electro-thermal FE Model using COMSOL Multiphysics® software of power vertical MOSFET used in the automotive industry is presented. This model is used to analyze the effects of bonding wire lift off defect and to study the influence of metallization thickness and ... Read More

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