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Explore the innovative ways multiphysics simulation is being used worldwide to advance research

Multiphysics modeling and simulation drives innovation across industries and academia — as is evidenced by the many uses showcased in the technical papers and posters presented by engineers, researchers, and scientists at the COMSOL Conference each year.

Draw inspiration from the recent proceedings collected below, or, to find a specific presentation or filter by application area or conference year/location, use the Quick Search tool.

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3D Modeling of Microwave Plasma Using Funer Model

O. Geoffroy[1] and H. Rouch[1]
[1]INOPRO, Villard de Lans, France

After previous microwave simulations done with very hard assumptions, we improve the model by using Funer model to improve prediction of plasma effects on the microwave coupling. Some parameters are still not well known and are used as adaptation parameters. An experience plan technique ... Read More

Variation of the Frost Boundary below Road and Railway Embankments in Permafrost Regions in Response to Solar Irradiation and Winds

N.I. Kömle[1] and W. Feng[2]
[1]Space Research Institute, Austrian Academy of Sciences, Graz, Austria
[2]State Key Laboratory of Frozen Soil Engineering, Cold and Arid Regions Environmental and Engineering Research Institute, Lanzhou, China

We present COMSOL solutions for a coupled gas flow and heat transfer problem, which occurs particularly when traffic pathways are constructed in high altitude and arctic regions, where the underground is frozen soil. To avoid melting of the frozen ground (which usually leads to ... Read More

Cascades of Secondary Particles in High Voltage Accelerators

M. Cavenago[1], P. Antonini[1][3], P. Veltri[2], N. Pilan[2], V. Antoni[2], and G. Serianni[2]
[1]INFN-LNL, Legnaro, Padova, Italy
[2]Consorzio RFX, Padova, Italy
[3]Centro Ric. E. Fermi, Roma, Italy

A very simplified system for high voltage test is studied, considering reason for voltage holding failures which are not covered by conventional and local design criteria. A first understanding of the problem is obtained by solving the electrostatic potential in a 2D axis symmetric ... Read More

TM Wave Propagation in Optical Nanostructures with a Third-Order Nonlinear Response: Modeling and Validation with COMSOL

A. Kildishev[1], E. E. Narimanov[1]
[1]Birck Nanotechnology Center, School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana, USA

An enhanced method is used for analysis of third-order nonlinearities in optical nanostructures with scalar TM (H-field) frequency domain formulation. After embedding it in COMSOL Multiphysics it is shown to produce fast and accurate results without superfluous vector E-field formalism. ... Read More

Measuring the Spectra of Metamaterials at an Oblique Incidence

X. Ni[1,2], Z. Liu[1,2], and A.V. Kildishev[1,2]
[1]School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana, USA
[2]Birck Nanotechnology Center, Purdue University, West Lafayette, Indiana, USA

The emergence of electromagnetic metamaterials has given rise to a variety of fascinating applications, including the perfect lens and the optical cloaking device. For a long time the study of the properties of metamaterials was limited to normal incidence only. However, it is extremely ... Read More

Simulations of Scanning Electrochemical Microscopy Experiments in Pure Negative and Positive Feedback Mode with Ring Microelectrodes

J. Mauzeroll[1], M. Mayoral[1], and D. Fabre[1]
[1]Department of Chemistry, Université du Québec à Montréal, Montreal, Quebec, Canada

Scanning electrochemical microscopy (SECM) is a powerful tool recently developed for studying structures and processes in micrometer and submicrometer sized systems. It can probe electron, ion, and molecule transfers, and other reactions at solid-liquid, and liquid-liquid, interfaces . ... Read More

COMSOL Derived Universal Scaling Model For Low Reynolds Number Viscous Flow Through Microfabricated Pillars – Applications to Heat Pipe Technology

N. Srivastava[1], and C.D. Meinhart[1]
[1]Department of Mechanical Engineering, University of California Santa Barbara, Santa Barbara California, USA

Cooling of high-power density electronic devices remains a challenge. Microfluidic heat-pipes with the potential of achieving ultra-high thermal conductivities offer a low-cost technology for cooling electronics. To achieve high thermal conductivity, it is critical to maximize the rate ... Read More

Modeling of Drying of Cellular Ceramic Structures: Coupled Electromagnetic and Multiphase Porous Media Model

A. Dhall[1], G. Peng[2], G. Squier[2], M. Geremew[3], L. Bogaczyk[2], J. George[3], W.A. Wood[3], and A.K. Datta[1]
[1]Biological and Environmental Engineering, Cornell University, Ithaca, New York, USA
[2]Manufacturing Technology & Engineering, Corning Inc., Sullivan Park, Corning, New York, USA
[3]Corporate Research, Corning Inc., Sullivan Park, Corning, New York, USA

Cellular ceramic substrates are extensively used for pollution control systems in vehicles. The manufacturing process of them can involve microwave drying. In this study, we describe the development of a modeling framework for the microwave drying process of these substrates. The ... Read More

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