See How Modeling and Simulation Is Used Across Industries
Multiphysics modeling and simulation drives innovation across industries and academia — as is evidenced by the many uses showcased in the technical papers and posters presented by engineers, researchers, and scientists at the COMSOL Conference each year.
Draw inspiration from the recent proceedings collected below, or, to find a specific presentation or filter by application area or conference year/location, use the Quick Search tool.
View the COMSOL Conference 2025 Collection
Cantilever vibration in fluid environment is probably one of the most common Fluid Structure Interaction problems in the field of Micro/Nano Electro Mechanical Systems. Usually the effect of fluid on cantilever oscillation is characterized in terms of mode resonance frequencies and ... Read More
This paper describes the development of a COMSOL model of Electro-Chemical-Mechanical Planarization (ECMP) that was validated with experimental data. ECMP is used for processing of semiconductor wafers. We developed a 2D model of flow of phosphoric acid solution (the electrolyte) between ... Read More