Zink Imaging Uses Simulation Apps to Optimize Print Head Designs
William T. Vetterling, Zink Imaging, MA, USA
William Vetterling, research fellow and manager of the Image Science Laboratory at Zink Imaging, created an intuitive and easy-to-use simulation app that computes the current distribution and heating throughout a thermal print head design and displays the computed results in a clear, uncluttered way. The app was built with the Application Builder tool available within COMSOL Multiphysics®.
Vetterling built the app by selecting inputs for the number of electrodes in the print head and their width. He expanded the app's functionality with the Form Editor and Method Editor tools. The app can be deployed to colleagues with COMSOL Server™.
Suggested Stories
The Unseen Wonders of Radiant Heating, Cooling, and Snowmelting
Viega designs residential and commercial radiant heating and cooling systems. By building simulation applications and ...
Elevating the Performance of Ionization Gauges with Simulation
Semiconductor manufacturing and particle physics research depend on high-vacuum or ultra-high-vacuum (HV/UHV) ...
Simulating Printhead Unimorph Actuators at FUJIFILM Dimatix
FUJIFILM Dimatix, a top producer of commercial inkjet printheads, uses multiphysics simulation to develop MEMS ...
Thermal Characterization of an Electronic Device with a Custom App
BE CAE & Test, a COMSOL Certified Consultant, created a thermal model of a surface-mount device for a client and ...
