Electronic Chip Cooling
Application ID: 47721
This tutorial model uses a heat sink geometry from the Part Library. The tutorial shows different approaches to heat transfer modeling when studying the cooling of an electronic chip.
In the first part, only the solid parts are modeled, while the convective airflow is modeled using Convective Heat Flux boundary conditions.
In the second part, the model is extended to include a fluid domain for the flow channel to compute the coupled temperature and velocity of the fluid, assuming nonisothermal behavior.
In the last part, surface-to-surface radiation is considered to see how significantly it contributes to the results.
This model example illustrates applications of this type that would nominally be built using the following products:Heat Transfer Module
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.