Thermal Curing Simulation
Application ID: 46651
This example exemplifies how to model thermal curing using the base package of COMSOL Multiphysics. A more detailed description of the phenomenon and the modeling process can be seen in the blog post "Modeling the Thermal Curing Process".
This model example illustrates applications of this type that would nominally be built using the following products:Heat Transfer Module
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.