Thermal Initial Stresses in a Layered Plate
Application ID: 273
The thermal stress in a layered plate is studied in this example. A plate consisting of two layers, a coating and a substrate layer, is stress and strain free at 800 degrees C. The temperature of the plate is reduced to 150 degrees C and thermal stresses are induced due to the difference in coefficients of thermal expansion. A third layer, the carrier layer, is then introduced in a stress-free state. Finally, the temperature is reduced to 20 degrees C, and as a result, there are thermal stresses in all layers.
This model example illustrates applications of this type that would nominally be built using the following products:MEMS Module Structural Mechanics Module
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
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