Embedded Microfluidic/Thermoelectric Generation System for Self-Cooling of Electronic Devices

R. Kiflemariam[1], H. Fekramandi[1], C. Lin[1]
[1]Department of Mechanical & Materials Engineering, Florida International University, Miami, FL, USA

A 3D electro-conjugate heat transfer model was made to study an embedded microfluidic/TEG system (μF/TEG) system. An innovative embedded microfluidic/TEG system (μF/TEG) system is proposed which enables a device to be able to provide power to its cooling system eliminating external power input and resulting in energy efficient and more reliable heat removal system. The research identifies important heat transfer, fluid flow and electrical parameters and optimization to enable the system to generate enough electricity to cool itself. COMSOL Multiphysics® software was utilized to analyze temperature and electrical characteristics of the embedded microfluidic/TEG system (μF/TEG) system