Simulation of Heat Transfer on Periodic Microstructured Surfaces for Evaporation Cooling
Evaporative cooling is a promising cooling method for dissipating high heat fluxes in high power density applications. One possibility to enhance heat flux is a generation of microstructures into the cooler surface. This enlarges the cooler surface and systematically affects the fluid flow as well as the boiling process. In this study the geometric arrangement of cylindrical pin microstructures with small aspect ratio was investigated by analyzing the conductive and convective components of heat transfer. Using COMSOL Multiphysics® a 3D model with the non-isothermal flow interface was created.