See How Modeling and Simulation Is Used Across Industries
Multiphysics modeling and simulation drives innovation across industries and academia — as is evidenced by the many uses showcased in the technical papers and posters presented by engineers, researchers, and scientists at the COMSOL Conference each year.
Draw inspiration from the recent proceedings collected below, or, to find a specific presentation or filter by application area or conference year/location, use the Quick Search tool.
View the COMSOL Conference 2025 Collection
Materials with an order variable in thermal conductivity as a function of temperature are desirable for thermoelectric heat energy recovery, building thermal insulation and solar thermal applications. Thermal Conductivity is an inherent material property. Engineering the fundamental ... Read More
The transformation of austenite (A) to ferrite (F) in steels, which is technologically important and of fundamental interest, still remains less well understood in some aspects. At intermediate undercooling F grows with a plate-like morphology (widmanstätten). Some calculations, which ... Read More
Introduction: Solver section of FEA plays a very important role; it takes the input from the preprocessor and solves millions of equations using numerical methods. Capability of any analysis tools can be measured based on the solver. Understanding the nature and operation of various ... Read More
Plasma Arc Welding (PAW) is one of the important arc welding processes commonly used in electronics, medical, automotive and aerospace industries due its high accuracy, finishing, and ability of welding any hard materials. It is an extension of Tungsten Inert Gas welding (TIG or GTAW). ... Read More
Thermoelectric sensors, which are capable to convert temperature gradients into electrical signals, hold promise for use in wearable body-temperature monitors and self-powered electronic devices. However, traditional flexible thermoelectric devices constructed with organic materials have ... Read More
随着大规模集成电路的发展，大尺寸电子级直拉单晶硅的需求与日俱增，而硅片尺寸增大的同时，氧相关缺陷带来的问题更加凸显。硅片中的氧相关缺陷有利有弊，因此直拉法生长单晶硅中的氧含量控制十分重要。本文基于COMSOL Multiphysics对12英寸电子级直拉单晶硅生长过程进行数值模拟分析，研究直拉单晶硅在不同凝固阶段下，晶体与熔体中氧浓度的变化，并计算出不同凝固阶段下氧在晶体和熔体两相中的浓度分布。通过考虑水冷屏，增加固液界面处的温度梯度，进而根据Voronkov理论计算出晶体中微缺陷区与“完美晶体区”。基于该模型，比较不同直径的坩埚对生长12寸直拉单晶硅的影响。结果表明 ... Read More
Resistive random access Memory (RRAM) is a non-volatile memory that operates by switching resistance between the formation (ON) and the rupture (OFF) of the conductive filaments (CF), representing the binary states of logic "0" and "1". RRAM is considered one of the most promising ... Read More
The high-temperature superconducting magnet (HTS) is one of the core technologies of a superconducting maglev. The effects of multiphysics fields including electromagnetic, mechanical, and thermal should be taken into consideration in design. Traditional design methods rely on the ... Read More
锂离子电池的安全长寿命运行离不开高效的热管理系统，其中浸没式液冷热管理系统的散热功率较大同时能实现电池组较高的温度一致性，是目前极具发展潜力的热管理方式。本研究利用COMSOL Multiphysics软件中的固体与流体传热模块和电池中的集总电池模块，并结合非等温流动和电化学热两个热多物理场，建立了浸没式液冷热管理系统的仿真模型，综合比较了三种浸没式液冷方式的散热能力，进一步通过COMSOL中的参数化扫描等功能研究探究了出入口位置、电池间距、冷却液热特性对浸没式液冷散热特性的影响。结果分析中采用了COMSOL丰富的后处理功能 ... Read More
本工作的主要内容是探究软包电池在充放电循环中由电池自身产热导致的温度分布以及温度对电化学反应速率的影响。模型中的电池传热模型由八个尺寸为1cm×1cm×180μm的电池微元组成，每个电池微元被视为一个均匀热源，使用COMSOL Multiphysics中的固体传热模块。电化学模型使用COMSOL Multiphysics中的电池模块，通过P2D模型计算电池的充放电过程以及反应热。每一个P2D模型对应传热模型中的一个电池微元，将电池的反应热视为电池微元的单位体积产热量。在三维传热模型的每一个电池微元中植入一个域探针，用来测量每个电池元在充放电过程中每一个时刻的平均温度 ... Read More