See How Modeling and Simulation Is Used Across Industries
Multiphysics modeling and simulation drives innovation across industries and academia — as is evidenced by the many uses showcased in the technical papers and posters presented by engineers, researchers, and scientists at the COMSOL Conference each year.
Draw inspiration from the recent proceedings collected below, or, to find a specific presentation or filter by application area or conference year/location, use the Quick Search tool.
View the COMSOL Conference 2025 Collection
Chemical reactions conducted under microwave irradiation have high reaction rates and high selectivity, but these reaction rates are not always reproducible. To achieve reproducibility, a solid-state microwave source with an ultra precise oscillator, high power amplifier module (HPA), ... Read More
High-power couplers working at 350 MHz for particle accelerator cavities are presently under development in the LEHIPA project at BARC. It is important to analyze RF losses on conducting surfaces and resulting thermal profiles. COMSOL Multiphysics® is used to study these coupled RF ... Read More
For the SAFARI Imaging Spectrometer, part of the SPICA satellite payload, a Calibration Source is under development. Challenges in the design include the low cooling power (few mW) available at cryogenic temperatures. COMSOL Multiphysics® simulations were used extensively in the design ... Read More
The optimisation of dimensions, materials choice of heaters in annealing furnaces are done with COMSOL Multiphysics® in 2D-axisymetry. Heat losses sources are identified and corrective actions can be taken in function of simulation results. A power saving of more than 50% is achieved ... Read More
Tecnotion produces linear motors for the high tech automation and semiconductor markets. Orthocyclically wound coils give the best performance because the largest number of windings can be packed into a given volume, as opposed to "wild winding", where the windings fall where they may. ... Read More
COMSOL Multiphysics® coupled with Solidworks® is employed to design, simulate and fabricate cartridges for a materials printer to accomplish in-situ curing of UV curable ink patterns as they are printed on flexible media for printed electronic circuit manufacturing. The cartridges ... Read More
This work describes a way to apply 3D Finite Element Analysis (FEA) to the thermal design of power electronic modules using simplified geometry models of the system components. The method here presented can overcome the problem of solving equation systems with a very high number of ... Read More
A two dimensional transient analysis of the conjugate optical-thermal fields induced in a multilayer thin film structure by a moving Gaussian laser source is carried out numerically in order to compare back and front laser treatment processes. Thermal and optical nonlinearity is induced ... Read More
The main purpose of this paper is to develop a proof of concept software that can simulate the geometry of engraved surfaces and can estimate the depth and width of engraved groove and associated laser parameters. For this purpose, COMSOL has been used to simulate the moving laser beam ... Read More
Multiphysics optimization of thermal-fluid systems is an emerging area of interest with application to the development of high performance cooling technologies for electronic systems. This paper builds on previous work focused on the development of a computational platform for numerical ... Read More