Explore the innovative ways multiphysics simulation is being used worldwide to advance research
Multiphysics modeling and simulation drives innovation across industries and academia — as is evidenced by the many uses showcased in the technical papers and posters presented by engineers, researchers, and scientists at the COMSOL Conference each year.
Draw inspiration from the recent proceedings collected below, or, to find a specific presentation or filter by application area or conference year/location, use the Quick Search tool.
View the COMSOL Conference 2025 Collection
Wire Electric Discharge Machining (WEDM) is widely used technique for machining intricate geometries. It is a spark erosion, non contact machining process and this gives it an advantage in machining metals irrespective of their hardness [1]. Main process parameters of WEDM are peak ... Read More
Active Infrared Thermography (IRT) is a family of non-destructive testing (NDT) techniques used for the detection of surface and buried defects in a wide range of materials. The method is robust and sensitive enough to be used even in harsh industrial environments However, the ... Read More
A technological revolution of Point-Of-Care (POC) devices is becoming essential, especially infectious diseases diagnosis for vulnerable population, it can be achieved by upgrading the Lab on Card device. In this device, the reaction is conducted by an Eppendorf tube as a biological ... Read More
Development of micro-pumps will allow the minimization of many mechanical, bio-engineered and electrical systems, for example: controlled drug delivery systems or liquid cooled microprocessors. The development of such system is facing two major challenges: the design of actuation ... Read More
This paper assesses the capability and sensitivity of COMSOL Multiphysics® to evaluate phase-changing material suitability for Thermal Energy Storage. The simulated system is a packed bed of encapsulated spheres, containing phase changing materials (PCM), placed inside a single ... Read More
This abstract describes a COMSOL® App that has been created to perform thermal simulations of an electronics assembly. The assembly comprises fourteen components including a photonic integrated circuit (PIC), a printed circuit board assembly (PCBA), a thermoelectric cooling (TEC) Peltier ... Read More
Environmental factors such as temperature and humidity can significantly affect the quality of the metal powder used in power bed fusion additive manufacturing, leading to variations in the integrity of finished components. It is therefore important to monitor and minimize the exposure ... Read More
Additive manufacturing processes are increasingly used for designing metallic parts with complex geometries. The current needs are focused on the manufacturing of large-scale parts, typically of meter range. However, for such dimensions, the traditional trial-and-error methodology used ... Read More
