See How Modeling and Simulation Is Used Across Industries
Multiphysics modeling and simulation drives innovation across industries and academia — as is evidenced by the many uses showcased in the technical papers and posters presented by engineers, researchers, and scientists at the COMSOL Conference each year.
Draw inspiration from the recent proceedings collected below, or, to find a specific presentation or filter by application area or conference year/location, use the Quick Search tool.
View the COMSOL Conference 2025 Collection
Introduction: Medium voltage reclosers are representing nowadays an important link between transmission power systems and low voltage grids. With a high level of renewable energy penetration, the medium voltage networks are becoming bidirectional. Therefore, the associated switching ... Read More
The Thomson coil’s (TC) inherent characteristics are appropriate to meet the needs of high speed actuators for mechanical switching devices in so-called smart grids. This is due to the massive forces that it can exert in the time scale of milliseconds. A coupled COMSOL Multiphysics model ... Read More
The accurate estimate of values of electromagnetic parameters are essential to determine the final circuit speeds and functionality for designing of high-performance integrated circuits and integrated circuits packaging. In this paper, the quasi-TEM analyses of symmetrical triple coupled ... Read More
A model utilizing interdimensional variable coupling is presented for simulating the thermal hydraulic interactions of the High Flux Isotope Reactor (HFIR) core at Oak Ridge National Laboratory (ORNL). The model’s domain consists of a three-dimensional fuel plate and a two-dimensional ... Read More
In this work the influence of the geometry of the Vickers indenter tip on relevant indentation properties is investigated during instrumented indentation operated in the macro range (i.e. with forces ranging from 2 to 200 N) and carried out in the case of a homogenized (i.e. heat ... Read More
Subduction processes have great importance as are related to volcanism and earthquake occurrence. Old and cold plates should subduct steeper than younger ones, but the subduction angle is highly variable and does not always correlate with the age of the plates. Some researchers propose a ... Read More
The microstrip line is widely used as the planar transmission line in microwave integrated circuits and high speed interconnecting buses. In this paper, we use COMSOL Multiphysics® to study multiconductor microstrip systems on microwave integrated circuits. We specifically illustrate ... Read More
Research at Fraunhofer EMI addresses the response of materials in extreme dynamic loads. Besides mechanical or thermal loads, intense electric pulse currents also represent an extreme dynamic load. Experimentally, metallic samples, mainly thick wires, were electro-mechanically loaded ... Read More
This paper utilizes lumped circuits equivalent and pressure acoustics to simulate the behavior of a PA loudspeaker in order to improve its design. Read More
Chemical vapor deposition (CVD) is a promising effective method for synthesis of graphene films. CVD graphene film is obtained from hydrocarbon species such as CH4 through complex catalytic chemical reactions on the surface of the catalyst. Therefore, studying the catalytic reaction ... Read More