Explore the innovative ways multiphysics simulation is being used worldwide to advance research
Multiphysics modeling and simulation drives innovation across industries and academia — as is evidenced by the many uses showcased in the technical papers and posters presented by engineers, researchers, and scientists at the COMSOL Conference each year.
Draw inspiration from the recent proceedings collected below, or, to find a specific presentation or filter by application area or conference year/location, use the Quick Search tool.
View the COMSOL Conference 2026 Collection
The anode baking process has gained significant attention since the 1980s due to its importance in Aluminium industry. A good anode baking process strives to achieve multiple goals including reduction of NOx from emissions. NOx generation is mainly due to the high-temperature ... Read More
Seasonal thermal energy storage (STES) systems are key components for expanding the renewables share in the energy scheme as they offer the dispatchability and flexibility. Therefore, thermal behaviour of such systems is of interest. STES can influence the surroundings causing a ... Read More
Non-contacting guided wave tomography based on laser ultrasonic waves can be used to inspect structures that are inaccessible to traditional ultrasound methods. Such structures could be, chemically or physically hard to reach, e.g. hot metal structures, metal implants inside tissue or ... Read More
Whispering-gallery mode resonators (WGR) are promising elements for future photonic devices, as they combine ultra-high quality factor with small size and mode volume. Many practical applications of such microresonators, such as ultra-sensitive chemical and biological sensors [1] electro ... Read More
The interaction of high power laser beam with metallic materials produces a number of interconnected phenomena that represent a serious challenge for numerical modeling, especially for creation of auto-consistent models. Additional difficulty consists in lack of data on materials ... Read More
Through Silicon Via (TSV) is one of the key technologies for 3D integration. It is a vertical electrical connection that passes through a silicon wafer and establishes the signal transmission between the front and the backside of the device. In the so-called “TSV last” integration ... Read More
Introduction With the vast development in the aerospace industry it is inevitable that currently used materials such as Nickel based super alloys will soon reach its peak performance. Hence developing alternative materials with similar properties that could be enhanced further is ... Read More
A concept of an adaptive sound absorbing material is proposed and investigated numerically using the COMSOL Multiphysics® Software suitable for the required advanced dual-scale modelling which involves solution of various problems of physics at the microscopic and macroscopic levels. A ... Read More
