Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Numerical Investigation of the Convective Heat Transfer Enhancement in Coiled Tubes

L. Cattani[1]
[1]Dipartimento di Ingegneria Industriale, Università degli Studi di Parma, Parma, Italy

The work is focused on the numerical analysis of forced convection in curved tubes investigating the correlation between the heat transfer and friction factor enhancement and the effects of the wall curvature. The analysis was performed by integrating the continuity, momentum and energy equations within COMSOL Multiphysics. The local Nusselt number reaches values higher than the ones expected ...

Coupled PDEs with Initial Solution from Data in COMSOL Multiphysics®

M. K. Gobbert[1], X. Huang[1], S. Khuvis[1], S. Askarian[1], B. E. Peercy[1]
[1]University of Maryland - Baltimore County, Baltimore, MD, USA

This paper presents information on techniques needed in COMSOL Multiphysics® to enable computational studies of coupled systems of PDEs for time-dependent non-linear problems. Furthermore, we demonstrate how to use data files as input for initial conditions. To illustrate the techniques, we consider a system of two time-dependent non-linear PDEs from mathematical biology that couples an ...

A Practical Method to Model Complex Three-Dimensional Geometries with Non-Uniform Material Properties Using Image-based Design and COMSOL Multiphysics®

J. Cepeda[1], S. Birla[2], J. Subbiah[2], H. Thippareddi[1]
[1]Department of Food Science & Technology, University of Nebraska, Lincoln, NE, USA
[2]Department of Biological Systems Engineering, University of Nebraska, Lincoln, NE, USA

Geometries with heterogeneous material properties are typically defined as a set of multiple parts, each part representing a different material. However, assembling or defining the individual parts of complex geometries can be difficult. A practical method based on image-based mesh generation, a custom algorithm for labeling materials, and interpolation functions of COMSOL Multiphysics® can be ...

Surface Plasmon Resonance

J. Crompton[1], S. Yushanov[1], L.T. Gritter[1], K.C. Koppenhoefer[1]
[1]AltaSim Technologies, Columbus, OH, USA

The resonance conditions for surface plasmons are influenced by the type and amount of material on a surface. Full insight into surface plasmon resonance requires quantum mechanics considerations. However, it can be also described in terms of classical electromagnetic theory by considering electromagnetic wave reflection, transmission, and absorption for the multi-layer medium. The two commonly ...

Study of Stent Deformation and Stress Developed at Different Stent Deployment Pressures

K. Basu[1], P. Ghosh[2], A. Chanda[1]
[1]School of Bio Science and Engineering, Jadavpur University, Kolkata, West Bengal, India
[2]Jadavpur University, Kolkata, West Bengal, India

According to clinical reports, cardiovascular disease has become a major global healthcare problem. The deposition of fats, cholesterol etc. at the arterials walls causes thrombus formation leading to stenosis and arterial blockage. To tackle this, along with arterial bypass, the use of Cardiovascular Stent is considered promising and effective (in single vessel and bi vessel diseases). While ...

Modeling of a Counter Flow Plate Fin Heat Exchanger - new

R. Jia[1], J. Hu[1], X. Xiong[2]
[1]Department of Mechanical Engineering, University of Bridgeport, Bridgeport, CT, USA
[2]Department of Electrical and Computer Engineering, University of Bridgeport, Bridgeport, CT, USA

Plate fin heat exchangers are widely used for heat recovery or cooling purposes in many industries, such as cryogenics, aerospace and automobile industries. This paper developed a numerical model to simulate the heat transfer and fluid flow in a counter flow plate fin heat exchanger and optimize its design parameters. The conjugate heat transfer in the finned plate and fluids in the channels ...

Design and Simulation of Unimorph Piezoelectric Energy Harvesting System

E. Varadarajan[1], M. Bhanusri[2],
[1]Research and Innovation Centre (RIC), IITM Research Park, Chennai, Tamil Nadu, India
[2]Department of Physics, Indian Institute of Technology (IIT) Madras, Chennai, Tamil Nadu, India

In this paper we made an attempt to maximize the power output in the different piezoelectric materials in a unimorph cantilever beam configuration. In this research, a macro scale unimorph piezoelectric power generator prototypes consists of an active piezoelectric layer, stainless steel substrate and titanium proof mass was designed for frequencies 60 Hz - 200 Hz. An analytical model of a micro ...

Study of Capacitance in Electrostatic Comb-Drive Actuators

P. Hanasi [1], B. G. Sheeparamatti [1], V. Abbigeri [1], N. Meti [1],
[1] Visvesvaraya Technological University, Belagavi, Karnataka, India

Capacitor is mainly defined as two conducting plates that can hold the opposite charges on it. These plates can be used either as a sensor or an actuator. If the relative distance between the two conductors changes as result of given input, then capacitance values will change. This results in basic of capacitive or electrostatic sensing configuration. On the other hand, if a voltage or the ...

High Curvature Bending of Ultra-Thin Chips and Chip-on-Foil Assemblies

D. van den Ende[1]
[1]Holst Centre / TNO, Eindhoven, The Netherlands

Ultra-thin chips of less than 20µm become flexible, allowing integration of silicon IC technology with highly flexible electronics. This combination allows for highly intelligent products of unprecedented thinness, flexibility and cost. Examples include sensor systems integrated into food packaging or healthcare and sport monitoring tags as wearable patches or even directly in clothing textile ...

Simulation of Current Density for Electroplating on Silicon Using a Hull Cell

F. Lima[1], U. Mescheder[1], H. Reinecke[3]
[1]Hochschule Furtwangen University, Furtwangen, Baden-Wuerttemberg, Germany
[3]Institut für Mikrosystemtechnik, Freiburg im Breisgau, Baden-Wuerttemberg, Germany

Electrodeposition has a major advantage over other methods of thin film deposition. It allows deposition at atmospheric pressure and room temperature, requiring inexpensive equipment. However, there are several parameters which can influence an electroplated metal layer quality. The current density distribution is taken into consideration. The Hull cell is an electrodeposition tank with a ...