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See How Multiphysics Simulation Is Used in Research and Development

Engineers, researchers, and scientists across industries use multiphysics simulation to research and develop innovative product designs and processes. Find inspiration in technical papers and presentations they have presented at the COMSOL Conference. Browse the selection below or use the Quick Search tool to find a specific presentation or filter by application area.

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Effective Mass Calculations Using COMSOL Multiphysics® for Thermomechanical Calibration

B. D. Hauer[1], C. Doolin[1], K. S. D. Beach[1], J. P. Davis[1]
[1]University of Alberta, Edmonton, AB, Canada

Over the past few decades, nano/micro-mechanical resonators have experienced tremendous improvements in measurement sensitivity. In order to ensure accuracy, it is crucial that each nano/micro-mechanical device is properly calibrated. Thermomechanical calibration provides a noninvasive ... Read More

Simulation of a New PZT Energy Harvester with a Lower Resonance Frequency Using COMSOL Multiphysics®

H. Elbahr[1], T. Ali[1,2], A. Badawi[1], S. Sedky[1]
[1]Zewail City of Science and Technology - Cairo, Cairo, Egypt
[2]Cairo University, Cairo, Egypt

Energy harvesting from environmental vibration nowadays is feasible because of natural oscillations like that caused by air or liquid flow and by exhalation or the heartbeat of a human body. This vibration frequency is typically low (in order of less than 1 kHz). Accordingly, low ... Read More

FEM Simulation of Generation of Bulk Acoustic Waves and their Effects in SAW Devices

A.K. Namdeo[1], N. Ramakrishnan[2], and H.B. Nemade[1]
[1]Department of Electronics and Communication Engineering, Indian Institute of Technology Guwahati, Guwahati, India
[2]Centre for Nanotechnology, Indian Institute of Technology Guwahati, Guwahati, India

This paper presents finite element method (FEM) simulation study of the generation of bulk acoustic waves (BAWs) and their effect on the performance of surface acoustic wave (SAW) devices, using COMSOL Multiphysics. A SAW delay line structure using YZ-cut lithium niobate substrate is ... Read More

Fracture on Circuit Board Internal Layers Due to Thermal Stress on Soldered Pins

F. Figueroa[1], P. Aguirre[1]
[1]Sensor Technik Wiedemann GmbH, Kaufbeuren, Germany

Circuit board failures are often ignored because they could be impreceptible. This simulation examines how internal layers around a soldered pin via subject to temperature changes during the soldering process are affected, show the forces involved and determine breaking points. A 2D ... Read More

Modeling of MEMS Based Bolometer for Measuring Radiations from Nuclear Power Plant

S. Nisitha[1], T. Satyanarayana[2], S. Sreeja[1]
[1]Department of EIE, Lakireddy Bali Reddy Engineering College, Mylavaram, Andhra Pradesh, India.
[2]NPMASS Centre, Department of EIE, Lakireddy Bali Reddy Autonomous Engineering College, Mylavaram, Andhra
Pradesh, India

There has been growing demand for high performance micro sensors capable of detecting nuclear radiations being released from various industries, Nuclear reactors. Radiations emitted from the radioactive materials are invisible and not directly detectable by human senses. Thus it is ... Read More

Universal Dielectric Response of Atmospheric Ice Using COMSOL Multiphysics®

U.N. Mughal[1], M.S. Virk[1], K. Zaman[1]
[1]Narvik University College, Narvik, Norway

Heterogeneous materials with different phases, are conductive and insulating (dielectric), and are physically present in different natural materials as e.g. atmospheric ice. Jonscher’s proposed ‘universal dielectric response’ is not sufficient for such materials, as it only reflects ... Read More

Finite Element Modeling for the Mechanical Behavior of Silicon Diaphragms Using COMSOL Multiphysics^®

J. Ren[1], M. Ward[1], Peter Kinnell[2], and Russell Cradock[2]

[1]School of Mechanical Engineering, University of Birmingham, Birmingham, United Kingdom
[2]GE Druck Limited, Fir Tree Lane, Leicester, United Kingdom

The silicon diaphragm is one of the most common structures in Micro-Electromechanical Systems (MEMS). However, it is susceptible to creep deformation at elevated temperatures. This paper presents a transient finite element model which simulates the mechanical behavior of the ... Read More

Improvement of a Steady State Method of Thermal Interface Material Characterization by Use of a Three Dimensional FEA Simulation in COMSOL

B. Sponagle[1], D. Groulx[1]
[1]Department of Mechanical Engineering, Dalhousie University, Halifax, NS, Canada

An FEA model of a steady state thermal interface material characterization apparatus was created in COMSOL Multiphysics 4.2a. This model was then fitted using three convection heat loss coefficients and the conductance of the TIM layer to a set of experimental measurements made using a ... Read More

Modeling of Near-Field Ultrasonic Levitation: Resolving Viscous and Acoustic Effects

I .F. Melikhov [1], A. S. Amosov [1], S. A. Chivilikhin [2],
[1] Corning Scientific Center, Saint Petersburg, Russia
[2] ITMO University, Saint Petersburg, Russia

Ultrasonic levitation is a novel technology for contactless handing of various objects. It is already used in various manufacturing processes where it is important to keep untouched surface. In this paper we introduce a model of so-called near-field ultrasonic levitation which allows ... Read More

Design and Analysis of Multilayered MEMS Microphone Using COMSOL Multiphysics®

Saranya srinivasa raghavgan[1], Sowmya Srinivasa raghavan[1], Shruti Venkatesh[1]
[1]Rajalakshmi Engineering College, Chennai, India

In this project, we report a design of MEMS microphone that is based on the application of porous silicon in improving the sensitivity of bulk micro machined capacitive pressure sensors. The property of a low Young’s modulus of porous silicon and its dependence on porosity have been ... Read More

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