See How Multiphysics Simulation Is Used in Research and Development
Engineers, researchers, and scientists across industries use multiphysics simulation to research and develop innovative product designs and processes. Find inspiration in technical papers and presentations they have presented at the COMSOL Conference. Browse the selection below or use the Quick Search tool to find a specific presentation or filter by application area.
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It was suggested long ago that a theoretical model of a near-cathode region in a DC glow discharge admits multiple steady-state solutions describing different modes of currrent transfer. Even the most simple self-consistent models should admit such multiple solutions. In the present ... Read More
Electro-thermal interaction is commonly considered only as a matter of joule heating. In addition, the Seebeck-, Peltier- and Thompson-Effects are significant in materials with high thermoelectric figure of merit Z. These thermoelectric materials have a high Seebeck-coefficient α, a good ... Read More
The frequency dependent electrical impedance of porous media is studied by modelling the charge transport in the electrolyte filled pore space using COMSOL Multiphysics. The corresponding experimental method, called Spectral Induced Polarization (or Impedance Spectroscopy), shows a ... Read More
The Levitron offers an interesting demonstration of natural magnetic levitation using permanent magnets. It is composed by a small magnetized top and a circular magnetized base with a hole on its center. The top is placed in an area where magnetic field configuration and gyroscopic ... Read More
The objective of this work has been to realize a feasibility study of a cooling device for a SQUID sensor using liquid nitrogen flowing through micro channels. The design consists of an epoxy cylindrical vacuum vessel skewed by a silicon microchannel heat sink. The SQUID sensor is ... Read More
The effect of metallization thickness on planar transmission lines plays an essential role in microwave integrated circuits and thin film technology, especially in the propagation characterization and the electric field distribution in the structures. The objective of this paper is to ... Read More
The development and analysis of interconnects in inhomogeneous structures such as very large scale integration chips, printed circuit boards, and multichip modules are essential for next-generation electronic products. In this paper, we illustrate fast and sufficiently accurate ... Read More
In this paper we present a new model for computing the current density and field distributions in superconductors by means of a periodic space-time formulation for finite elements (FE). By considering a space dimension as time, we can use a static model to solve a time dependent problem. ... Read More
We have developed a model for computing current and field distributions in multifilamentary superconducting thin films subjected to the simultaneous effects of transport ac current and applied dc field perpendicular to the sample. The model is implemented in COMSOL’s PDE module (general ... Read More
Finite element analysis provides new insights into the electrical behavior of conducting adhesives. We show that at a contact between a spherical conducting particle and a flat conducting substrate the current distribution is non-uniform: the current is concentrated at the periphery of ... Read More