Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Design of MEMS based Polymer Microphone for Hearing Aid Application

V. S. Nagaraja[1], Ramanuja H. S.[1], Deepak K[1], S. L. Pinjare[1]
[1]Electronics and Communication Engineering, Nitte Meenakshi Institute of Technology, Bangalore, Karnataka, India

In this work, a MEMS based condenser microphone [1,2] using Polyimide as the diaphragm has been designed. The microphone structure has a backplate placed on top of the diaphragm. The backplate and the diaphragm are made up of polyimide. The two polyimide plates are separated by air gap which is achieved by using Aluminium as a sacrificial layer in between, which is etched away to create the air ...

Toward Energy Zero Building: A COMSOL Multiphysics® Model of Building and its HVAC System - new

F. Bruno[1]
[1]ENERSPACE Srl, Genoa, Italy

A model built with COMSOL Multiphysics® to exploit meteorological forecasts and instant outdoor meteorological data (temperature, solar radiation, moisture, wind speed and direcition, etc.) together with indoor ambient data (air temperature, radiant temperature of enclosures, etc), building parameters (mass, orientation, surface, structural composition, etc.) and historical consumption of ...

On the Formation of a Sticking Layer on the Bearing during Thin–Section Aluminium Extrusion

X. Ma[1], M.B. de Rooij[2], and D.J. Schipper[2]

[1]Materials Innovation Institute, Enschede, The Netherlands
[2]University of Twente, Enschede, The Netherlands

This paper describes the use of COMSOL Multiphysics® to determine the shear layer thickness in thin–section aluminum extrusion, based on the minimum work criterion. The studied two aluminum alloys are AA 6063 and AA 7020. The results show that a continuous shear layer featuring shear localization due to localized thermal softening is not possible to form under typical thin&ndash ...

COMSOL-Based Nuclear Reactor Kinetics Studies at the HFIR

D. Chandler[1], J. Freels[2], R. Primm III[3], and G. Maldonado[1]
[1]Department of Nuclear Engineering, University of Tennessee, Knoxville, TN
[2]Research Reactors Division, Oak Ridge National Laboratory, Oak Ridge, TN
[3]Primm Consulting, LLC., Knoxville, TN

The computational ability to accurately predict the dynamic behavior of a nuclear reactor core in response to reactivity-induced perturbations is an important subject in reactor physics. Space-time and point kinetics methodologies were developed for the purpose of studying the transient-induced behavior of the High Flux Isotope Reactor’s (HFIR) compact core. The space-time simulations employed ...

Electromagnet Shape Optimization using Improved Discrete Particle Swarm Optimization (IDPSO)

R. S. Wadhwa[1], T. Lien[1], and G. Monkman[2]
[1]NTNU Valgrinda, Inst. for produksjons- og kvalitetstek., Trondheim, Norway
[2]FH Regensburg, Regensburg, Germany

The magnetic field gradient produced by an electromagnet gripper head depends on its design. Stochastic Methods offer certain robustness to the design optimization process. In this paper, Improved Discrete Particle Swarm Optimization (IDPSO) searching technique is applied to the shape and magnetic field gradient optimization of an electromagnet head. The magnetic field and forces are ...

Influência da Camada de Ar Sobre a Deformação de uma Embalagem de Líquido com Cartão Tipo LPB - new

I. Neitzel[1], K. B. Matos[1], L. R. Pesch[1]
[1]Faculdade de Telêmaco Borba - FATEB, Telêmaco Borba, Paraná, Brasil

As embalagens de produtos alimentícios são hoje em dia predominantemente feitas com cartão tipo LPB (Liquid Packaging Board) e usualmente estocadas de forma empilhada, tanto nas prateleiras como nos depósitos dos supermercados. O LPB é um compósito multicamadas de construção complexa, envolvendo, tipicamente, papel produzido com fibras virgens, polietileno e alumínio. O alimento líquido ao ser ...

Rapid Control Prototyping for the Production of Functionally Graded Materials with Tailored Microstructural Properties Utilizing Comsol Multiphysics

J. Clobes[1,2], H.-J. Watermeier[2], M. Alsmann[2], H. H. Becker[2], and K. Steinhoff[1]
[1]University of Kassel - Chair of Metal Forming Technology, Kassel, Germany
[2]Volkswagen AG, Kassel, Germany

Within the field of hot metal bulk forming the demand arises for fully three-dimensionally tailored properties at the microstructural level, nevertheless, reaching a predefined geometry with such tailored properties puts high requirements on the control mechanisms utilized in the process chain for combined heating, metal forming, and cooling processes. A simulation based rapid control ...

Is Experimentation More Intuitive?

R. Venkataraghavan
Unilever R&D
Bangalore, India

Venkataraghavan is the Discover Category Leader, Water, working at the interface of Science, Technology and Business, for developing solutions and products for water purification at Unilever R&D, Bangalore. He joined Unilever in 2002 and earlier worked in interfacial science, materials science and electrodynamics for the Laundry Category. Venkataraghavan also had a stint with Unilever Technology ...

Equation-Based Modelling: True Large Strain, Large Displacement and Anand's Plasticity Model with COMSOL's Moving Mesh Application Mode

O. Toscanelli[1], V. Colla[1], and M. Vannucci[1]

[1]Scuola Superiore S. Anna, Pontedera, PI, Italy

In this work the solution of the structural problem obtained by mean of the velocity approach is presented. More in detail the balance and constitutive equations are expressed in Eulerian form, the mesh is not material. The approach is general, is suitable both for material boundary or no-material boundary and for a generic material model. The Hooke's elastic model and the Anand's plasticity ...

Multiphysics Software Applications in Reverse Engineering

W. Wang[1], K. Genc[2]
[1]University of Massachusetts, Lowell, MA, USA
[2]Simpleware, Exeter, United Kingdom

During the past decade reverse engineering has become a common and acceptable practice utilized by many aftermarket suppliers, and even original equipment manufacturers (OEM). This presentation focuses on the applications of multiphysics software such as COMSOL and Simpleware® in reinventing the design details and manufacturing processes of an existing part in the absence of the original design ...