Epoxy Resin Curing Process for Basin-Type Insulators
Application ID: 137951
Basin-type insulators are essential components in Gas-Insulated Metal-Enclosed Switchgear (GIS). During manufacturing, the epoxy resin curing process can generate residual stresses that may lead to crack formation. Over time, such cracks can trigger partial discharges, degrading the electrical insulation performance of the GIS and compromising equipment safety.
This example simulates the epoxy resin curing process to analyze the residual stresses in basin-type insulators. It incorporates curing reactions, heat generation, and curing shrinkage to enable accurate prediction of residual stresses.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
- COMSOL Multiphysics® and
- Design Module and
- Polymer Flow Module and
- either the MEMS Module, Metal Processing Module, or Structural Mechanics Module
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.