Four-Point Bending Test of an IGBT Module
Application ID: 124181
The four-point bending test is a conventional test method used to test the mechanical properties of materials subjected to bending. It is one of the main reliability tests for semiconductors. This model demonstrates the stress analysis of an IGBT module subjected to a four-point bending test.
The test condition is based on the Standard BS ISO 23212: 2020.
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