The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.

Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. To download the MPH-files, log in or create a COMSOL Access account that is associated with a valid COMSOL license. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.


Continuous Casting

This example models the casting process of a metal rod from liquid to solid state using the Non-Isothermal Flow multiphysics interface, which combines heat transfer and fluid flow. The model describes the fluid and solid flow and heat transport, including the phase transfer from melt to solid. This phase change causes momentum changes, latent heat release and a variation in physical ...

Steady-State 2D Axisymmetric Heat Transfer with Conduction

This model how to build and solve a conductive heat transfer problem using the Heat Transfer interface. The model, taken from a NAFEMS benchmark collection, shows an axisymmetric steady-state thermal analysis. As opposed to the NAFEMS benchmark model, we use the temperature unit kelvin instead of degrees Celsius for this model.

Heat Generation in a Disc Brake

This example models the transient heating, and final temperature, of a disc brake of a car in brake-and-release sequence. It is important to model the transient heating and the following convective cooling to determine the minimum interval between a series of similar brake engagements. If the cooling is insufficient the disc overheats and results in brake failure. The model uses the Heat ...

Contact Switch

This model illustrates how to implement a multiphysics contact. It models the thermal and electrical behavior of two contacting parts of a switch. The electrical current and the heat flow from one part to the other only through the contact surface. The contact switch device has a cylindrical body and plate hook shapes at the contact area. There, the thermal and electrical apparent resistances ...

Turbulent Flow Over a Backward Facing Step

The backward facing step is an interesting case for studying the performance and solution strategy of a turbulence model. In this case, the flow is subjected to a sudden increase of cross-sectional area, resulting in a separation of flow starting at the point of expansion. Spatial variations in the velocity field cause production of turbulence outside the wall region and its interaction with ...

Evaporation in Porous Media with Small Evaporation Rate

Evaporation in porous media is an important process in food and paper industry among others. Many physical effects must be considered: fluid flow, heat transfer in porous media and transport of moisture. This tutorial describes how dry air flowing through a humid porous medium can partially dry it. It is assumed that the initial amount of liquid water in the porous medium is large enough and ...

Thermal Stress Analysis of a Turbine Stator Blade

The conditions within gas turbines are extreme. The pressure can be as high as 40 bar, and the temperature more than 1000 K. Any new component must therefore be carefully designed to be able to withstand thermal stresses, vibrations and loads asserted by the fluid rushing through the turbine. If a component fails, the high rotational speeds can result in a complete rupture of the whole turbine. ...

Thermal Contact Resistance Between an Electronic Package and a Heat Sink

This example reproduces parts of the study of Ref. 1 on the thermal contact resistance at the interface between a heat sink and an electronic package. Eight cooling fins equip the cylindrical heat sink and contact is made at the radial boundaries of the package. The efficiency of the device depends on the cooling of the fins and the heat transfer from the package to the heat sink. This model ...

Heat Transfer in a Surface-Mount Package for a Silicon Chip

All integrated circuits—especially high-speed devices—produce heat. In today’s dense electronic system layouts heat sources are many times placed close to heat-sensitive ICs. Designers of printed-circuit boards often need to consider the relative placement of heat-sensitive and heat-producing devices, so that the sensitive ones do not overheat. One type of heat-generating device is a voltage ...

Parasol and Solar Irradiation

The Parasol and Solar Irradiation app illustrates how to model the thermal effects of the sun as an external radiative source. You can use the app to investigate the solar irradiation on a beach with two coolers placed in different positions under a parasol. You can vary the length of the day and set the location of the beach – anywhere throughout the world. A typical modification of this app ...