The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
This example shows how to set up multiple sandwiched thin layers with different thermal conductivities in two different ways. First, the composite is modeled as a 3D object. In the second approach, the thin domains are modeled with thermal resistors in the Lumped Thermal System ... Read More
Drying of porous media is an important process in the food and paper industry among others. Many physical effects must be considered: fluid flow, heat transfer with phase change, and transport of participating liquids and gases. All of these effects are strongly coupled, and predefined ... Read More
The suite of models examine the air cooling of circuit boards populated with multiple integrated circuits (ICs), which act as heat sources. Two possible cooling scenarios are depicted: vertically aligned boards using natural convection, and horizontal boards with forced convection (fan ... Read More
All integrated circuits (ICs) — especially high-speed devices — produce heat. In today’s dense electronic system layouts, heat sources are many times placed close to heat-sensitive ICs. Designers of printed circuit boards often need to consider the relative placement of heat ... Read More
This tutorial model uses a heat sink geometry from the Part Library. The tutorial shows different approaches to heat transfer modeling when studying the cooling of an electronic chip. In the first part, only the solid parts are modeled, while the convective airflow is modeled using ... Read More
Thermoelectric elements are often used to cool or heat electronic components to a desired temperature. In such simulations, you are typically not interested in the behavior of the thermoelectric element itself but want to use its performance characteristics to model the overall response ... Read More
Fluid dampers are used in military devices for shock isolation and in civil structures for suppressing earthquake-induced shaking and wind-induced vibrations, among many other applications. Fluid dampers work by dissipating the mechanical energy into heat. This model shows the phenomenon ... Read More
This model demonstrates how to define Earth properties that are spatially varying on the planet. A satellite in orbit experiences solar, albedo, and planetary infrared (IR) loads, where albedo and planetary IR can vary with latitude and longitude. In this example, these inputs are read ... Read More
This model demonstrates how to compute satellite temperature over multiple orbit periods by coupling Orbital Thermal Loads to Heat Transfer in Solids. The direct solar, albedo, and Earth infrared thermal loads are computed over a single orbit, and are periodically repeated over multiple ... Read More
This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to ... Read More
