The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.

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Heat Transfer Modulex

Steady-State 2D Axisymmetric Heat Transfer with Conduction

This model how to build and solve a conductive heat transfer problem using the Heat Transfer interface. The model, taken from a NAFEMS benchmark collection, shows an axisymmetric steady-state thermal analysis. As opposed to the NAFEMS benchmark model, we use the temperature unit kelvin ... Read More

Heat Conduction with a Localized Heat Source on a Disk

This classical verification model solves the steady state temperature distribution in a plan disk heated by a localized heat source at its center. It shows and compare different ways to define a heat source localized on a small domain by representing it either as a geometrical point or a ... Read More

Convection Cooling of Circuit Boards — 3D Natural Convection

The suite of models examine the air cooling of circuit boards populated with multiple integrated circuits (ICs), which act as heat sources. Two possible cooling scenarios are depicted: vertically aligned boards using natural convection, and horizontal boards with forced convection (fan ... Read More

Heat Transfer in a Surface-Mount Package for a Silicon Chip

All integrated circuits—especially high-speed devices—produce heat. In today’s dense electronic system layouts heat sources are many times placed close to heat-sensitive ICs. Designers of printed-circuit boards often need to consider the relative placement of heat-sensitive and heat ... Read More

Thermoelectric Cooler

Thermoelectric coolers are widely used for electronics cooling in various application areas, ranging from consumer products to spacecraft design. Exploiting the Peltier effect, they consist of several thermoelectric legs sandwiched between two thermally conductive plates, one cold and ... Read More

Thermal Contact Resistance Between an Electronic Package and a Heat Sink

This example reproduces parts of the study of Ref. 1 on the thermal contact resistance at the interface between a heat sink and an electronic package. Eight cooling fins equip the cylindrical heat sink and contact is made at the radial boundaries of the package. The efficiency of the ... Read More

Thermal Modeling of a Microchannel Heat Sink

Thermal management has become a critical aspect of today’s electronic systems, which often include many high-performance circuits that dissipate large amounts of heat. Many of these components require efficient cooling to prevent overheating. Some of these components, such as processors, ... Read More

Tin Melting Front

This example demonstrates how to model phase transition by a moving boundary interface according to the Stefan problem. A square cavity containing both solid and liquid tin is submitted to a temperature difference between left and right boundaries. Fluid and solid parts are solved in ... Read More

Convection Cooking of Chicken Patties

When cooking food, such as a patty, in convection ovens there is a trade off in the heating method. If the patty is heated at a low oven temperature the cooking is slow and the patty dries out, resulting in a poor taste. If the patty is heated rapidly at a high temperature, it is ... Read More

Friction Stir Welding of an Aluminum Plate

In friction stir welding, a rotating tool moves along the weld joint and melts the aluminum through the generation of friction heat. The tool’s rotation stirs the melted aluminum such that the two plates are joined. In this model, two aluminum plates are joined by generating friction ... Read More