The Application Gallery features COMSOL Multiphysics tutorial and demo app files pertinent to the electrical, mechanical, fluid, and chemical disciplines. You can download ready-to-use tutorial models and demo apps with step-by-step instructions for how to create them yourself. The examples in the gallery serve as a great starting point for your own simulation work.

Use the Quick Search to find tutorials and apps relevant to your area of expertise. Log in or create a COMSOL Access account that is associated with a valid COMSOL license to download the MPH-files.


Heat Transfer in a Surface-Mount Package for a Silicon Chip

All integrated circuits—especially high-speed devices—produce heat. In today’s dense electronic system layouts heat sources are many times placed close to heat-sensitive ICs. Designers of printed-circuit boards often need to consider the relative placement of heat-sensitive and heat-producing devices, so that the sensitive ones do not overheat. One type of heat-generating device is a voltage ...

Fluid Damper

Fluid dampers are used in military devices for shock isolation and in civil structures for suppressing earthquake-induced shaking and wind-induced vibrations, among many other applications. Fluid dampers work by dissipating the mechanical energy into heat. This model shows the phenomenon of viscous heating and consequent temperature increase in a fluid damper. Viscous heating is also important ...

Silica Glass Block Coated with a Copper Layer

In this time-dependent model, a silica block of glass, coated with a thin copper layer is subjected to a heat flux. Copper is a highly conductive material, while the silica glass is of poor thermal conductivity, which sets up an highly-varied temperature differential. The model must therefore account for a highly conductive layer. This is done, using a the Highly Conductive Layer feature in ...

Thermal Modeling of a Microchannel Heat Sink

Thermal management has become a critical aspect of today’s electronic systems, which often include many high-performance circuits that dissipate large amounts of heat. Many of these components require efficient cooling to prevent overheating. Some of these components, such as processors, require a heat sink with cooling fins that are exposed to forced air from a fan. This discussion develops the ...

Radiative Cooling of a Glass Plate

When producing glass, the glass melt is cooled down through radiation to form the final shape, subjecting it to stresses. Numerical treatment of radiative heat transfer, using the Radiative Transfer Equation (RTE), helps to optimize this process. COMSOL Multiphysics provides three discretization methods for modeling radiation in participating media and solving the RTE: the Rosseland ...

Heat Conduction with a Localized Heat Source on a Disk

This classical verification model solves the steady state temperature distribution in a plan disk heated by a localized heat source at its center. It shows and compare different ways to define a heat source localized on a small domain by representing it either as a geometrical point or a small disk. Both modelings have analytical solutions to which the obtained numerical results can be ...

Cross-Flow Heat Exchanger

This model solves the fluid flow and heat transfer in a micro heat exchanger made of stainless steel. These types of heat exchangers are found in lab-on-chip devices in biotechnology and micro reactors, for example for micro fuel cells. The model takes heat transferred through both convection and conduction into account. A square cross-section is used for the fluid channels instead of ...

Marangoni Effect

Marangoni convection occurs when the surface tension of an interface (generally liquid-air) depends on the concentration of a species or on the temperature distribution. In the case of temperature dependence, the Marangoni effect is also called thermo-capillary convection. The Marangoni effect is of primary importance in the fields of welding, crystal growth and electron beam melting of ...

Rapid Thermal Annealing

In the semiconductor industry, rapid thermal annealing (RTA) is a semiconductor process step used for the activation of dopants and the interfacial reaction of metal contacts. In principle, the operation involves rapid heating of a wafer from ambient to approximately 1000–1500 K. As soon as the wafer reaches this temperature, it is held there for a few seconds and then finally quenched. An ...

Disk-Stack Heat Sink

This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to even out the temperature distribution. This exercise highlights a number of useful modeling techniques such ...