The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.

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Thermo-Mechanical Analysis of a Surface-Mounted Resistor

The drive for miniaturizing electronic devices has resulted in today’s extensive use of surface-mount electronic components. An important aspect in electronics design and the choice of materials is a product’s durability and lifetime. For surface-mount resistors and other components producing heat it is a well-known problem that temperature cycling can lead to cracks propagating through the ...

View Factor Computation

When simulating surface-to-surface radiation, we rely on the view factors between elements of diffuse surfaces that emit and receive radiation. To compute surface-to-surface radiation in a given geometry, operators are created by the heat interface and can be used to evaluate view factors in postprocessing. This model shows how to compute view factors using the operators provided by surface-to ...

Out-of-Plane Heat Transfer for a Thin Plate

This example models heat transfer in a thin rectangular metal plate. Because the plate’s thickness is only 1/100 of its length and width, you can simulate the process using a 2D approximation. The plate has a fixed temperature at one end and is isolated at the other. A surrounding liquid cools the plate by convection. In addition, the model considers surface-to-ambient radiation.

Optimizing a Thermal Process

A thermal processing scenario is modeled whereby two heaters raise the temperature of a gas flowing through a channel. The Optimization Module is used to find the heater power to maximize the outflow temperature, while maintaining a constraint on the peak temperature at the heaters themselves.

Flash Method

The flash method is widely used for measuring the thermal conductivity of a thin sample material that is about the size of a coin. The sample material is submitted to a laser pulse on one of its faces. In turn, the opposite face is heated up by around 1 K. As the pulse is uniform and well defined, you can measure the temperature variation on the other side. Thereby, you can measure the thermal ...

Thermal Modeling of a Microchannel Heat Sink

Thermal management has become a critical aspect of today’s electronic systems, which often include many high-performance circuits that dissipate large amounts of heat. Many of these components require efficient cooling to prevent overheating. Some of these components, such as processors, require a heat sink with cooling fins that are exposed to forced air from a fan. This discussion develops the ...

Disk-Stack Heat Sink

This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to even out the temperature distribution. This exercise highlights a number of useful modeling techniques such ...

Non-Isothermal MEMS Heat Exchanger

The example concerns a stainless-steel MEMS heat exchanger, which you can find in lab-on-a-chip devices in biotechnology and in microreactors such as for micro fuel cells. This model examines the heat exchanger in 3D, and it involves heat transfer through both convection and conduction. The model solves for the temperature and heat flux in the device and investigate the convective term’s ...

Silica Glass Block Coated with a Copper Layer

In this time-dependent model, a silica block of glass, coated with a thin copper layer is subjected to a heat flux. Copper is a highly conductive material, while the silica glass is of poor thermal conductivity, which sets up an highly-varied temperature differential. The model must therefore account for a highly conductive layer. This is done, using a the Highly Conductive Layer feature in ...

Composite Thermal Barrier

This example shows how to set up multiple sandwiched thin layers with different thermal conductivities in two different ways. First, the composite is modeled as a 3D object. In the second approach the Thin thermally resistive layer boundary condition is used to avoid resolving the thin domains. The technique is useful when modeling heat transfer through thermal barriers like multilayer coatings.