The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
This example shows a 2D steady-state thermal analysis including convection to a prescribed external (ambient) temperature. It is given as a benchmarking example. The benchmark result for the target location is a temperature of 18.25 C. The COMSOL Multiphysics model, using a default mesh ... Read More
A steel billet is quenched in oil from its austenitic state. A 2D axisymmetric model is used to simulate the coupled problem of austenite decomposition, heat transfer, and solid mechanics. During the quenching process, the austenite decomposes into a combination of ferrite, pearlite, ... Read More
Surface micromachined thin films are often subject to residual stress. This COMSOL Multiphysics example describes a thin film resonator with straight or folded cantilever beam springs. The resonance frequencies of the resonator are affected by thermal stress. Using folded springs ... Read More
Thermoelectric elements are often used to cool or heat electronic components to a desired temperature. In such simulations, you are typically not interested in the behavior of the thermoelectric element itself but want to use its performance characteristics to model the overall response ... Read More
This example demonstrates how to use temperature dependent materials within the Nonlinear Structural Materials Module. A large container holds pressurized hot water. Several pipes are attached to the pressure vessel. Those pipes can rapidly transfer cold water in case of an emergency ... Read More
This model is a benchmark model for the Slip Flow interface. It is based on both analytic and numeric calculations. Air at atmospheric pressure flows through a conducting micro-channel connecting two reservoirs maintained at different temperatures. A flow between the two reservoirs ... Read More
This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to ... Read More
Carbon deposition on the surface of solid catalysts is commonly observed in hydrocarbon processing. A known problem is that carbon deposits can impede the activity of catalysts as well as block the flow of gas through a catalyst bed. This example investigates the thermal decomposition ... Read More
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... Read More
This model is an introduction to defining and verifying a satellite orbit, and computing the solar, albedo, and Earth infrared thermal loads. A 1U CubeSat is in a circular orbit at 400km altitude, inclination of 50°, and longitude of ascending node of 0°. The satellite is rotating slowly ... Read More