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Residual Stress in a Thin Film Resonator - 3D

Application ID: 477

Surface micromachined thin films are often subject to residual stress. This COMSOL Multiphysics example describes a thin film resonator with straight or folded cantilever beam springs. The resonance frequencies of the resonator are affected by thermal stress. Using folded springs relieves this effect.

The example is made up of four models: two thin film resonators with folded cantilever beam springs in 2D and 3D, and two thin film resonators with straight cantilever beam springs in 2D and 3D. The folded flexures relieve axial stress.

This model is included as an example in the following products:

MEMS Module

The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.