The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
This example shows how to model prestressed bolts. The bolt geometry is taken from the Part Libraries. For comparison, one of the bolts is modeled using a thread contact formulation, whereas the other bolt is connected to the bolt hole by a pure continuity condition. The reduced ... Read More
In this model, we introduce a cloaking method using an electrically tuned monolayer of graphene. We will show that when a cylindrical dielectric scatterer is covered in graphene, the scattering cross section is greatly reduced at the designated frequency, making it electromagnetically ... Read More
This model demonstrates how to setup a Time Domain to Frequency FFT study for a distributed Bragg reflector (DBR) structure. The results agree well with the results of a regular Frequency domain study. Read More
A transient model of a capacitor is solved in combination with an external electrical circuit. The finite element model of the capacitor is combined with a circuit model of a voltage source and a resistor. A step change in voltage is applied, and the transient current through the ... Read More
At the electrode-electrolyte interface, there is a thin layer of space charge in a diffuse double layer. This may be of interest when modeling devices such as electrochemical capacitors and nanoelectrodes. This tutorial example shows how to couple the Nernst-Planck equations to the ... Read More
A surface mount resistor is subjected to thermal cycling. The difference in the thermal expansion of different materials will introduce stresses in the structure. The solder which connects the resistor with the printed circuit board is seen as the weakest link in the assembly. It ... Read More
This model simulates an LED that emits in the infrared part of the electromagnetic spectrum. The device structure is made up of a single p-n junction formed by a layer of p-type doping near the top surface of an otherwise n-type wafer. This kind of device geometry is simple and cheap to ... Read More
This example presents a homogenized model of a corrugated sheet based on a unit cell approach. The numerically obtained equivalent stiffness matrices are compared with various analytical models. Two corrugation profiles, trapezoidal and round, are considered in this example. Read More
