The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. To download the MPH-files, log in or create a COMSOL Access account that is associated with a valid COMSOL license. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
Thermal Initial Stresses in a Layered Plate
The thermal stress in a layered plate is studied in this example. A plate consisting of two layers, a coating and a substrate layer is stress and strain free at 800 degrees C. The temperature of the plate is reduced to 150 degrees C and thermal stresses are induced. A third layer, the carrier layer, is added and the thermal stresses in the coating and a substrate layer are added as an initial ...
Modeling Stress Dependent Elasticity
This example shows how to implement a stress dependent material model. The Young's modulus changes based on the stress value.
Peristaltic Pump
In a peristaltic pump, rotating rollers squeeze a flexible tube. As the rollers move along the tube, the fluid in the tube follows the motion. The main advantage of the peristaltic pump is that no seals, valves or other internal parts ever touch the fluid. Due to their cleanliness, peristaltic pumps have found many applications in the pharmaceutical, chemical, biomedical and food industries. ...
Single Edge Crack
This model deals with the stability of a plate with an edge crack that is subjected to a tensile load. To analyze the stability of exciting cracks, fracture mechanics can be utilized. A commonly used parameter in fracture mechanics, used to predict if a specific crack will cause the plate to fracture, is the so-called stress intensity factor KI. When this calculated value becomes equal to ...
Thermal Expansion in a MEMS Device
This model analyzes the thermal expansion in a MEMS device, such as a microgyroscope, where thermal expansion should be minimized. The device is made from the copper-beryllium alloy UNS C17500 and uses temperature-dependent material properties from the Material Library. The purpose of this model is to exemplify the use of the Material Library in COMSOL Multiphysics. This library contains more ...
Prestressed Bolts in a Tube Connection
A tube connection consisting of a flange with eight prestressed bolts is subjected to a set of loads made up of an internal pressure, axial force, and external bending moment. The model domain consists of 1/4 of the full geometry, since there are two planes of symmetry. The study consists of two steps: prestressing the bolts and studying how the stress state in the tube and the bolts varies ...
Sliding Wedge
A contactor wedge is subject to a gravity load and is forced to slide due to a boundary load over a rigid target wedge surface, both infinitely wide. Horizontal linear springs are also connected between the left vertical boundary and the ground. This is a large sliding problem including contact pressure for a constant contact area and friction force calculations. A penalty/barrier method is ...
Connecting Shells and Beams
Many engineering structures consist of thin and slender components, where a full solid model will result in extremely many small elements. For such structures, it is much more efficient to use shell or beam elements. In this tutorial and verification model, it is shown how to connect beam and shell elements in different situations. The results are also compared to a solid model of the same ...
Thermo-Mechanical Analysis of a Surface-Mounted Resistor
The drive for miniaturizing electronic devices has resulted in today’s extensive use of surface-mount electronic components. An important aspect in electronics design and the choice of materials is a product’s durability and lifetime. For surface-mount resistors and other components producing heat it is a well-known problem that temperature cycling can lead to cracks propagating through the ...
Connecting Shells and Solids
This tutorial model shows how to model a structure using both shells and solids, and how to create the transition between the two modeling domains. Results are compared between the shell solution and the full 3D solution, and the effects of the transition are highlighted.
